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New Products

XJTAG Development System v. 2.6 boundary scan software comes with a new library that can auto-suggest the correct file based on the bill of materials and netlist information. Library is preinstalled with thousands of device files. Once BoM is entered, user can hit Suggest button, bringing up a selection of possible files, including common logic devices and a range of other parts. Now comes with new .NET interface and LabVIEW VIs. Can use formatted XJEase text output and access Layout Viewer.

XJTAG, www.xjtag.com

Z-Check Fixture series is for impedance verification on printed circuit boards with 50 ohm probing solutions; comes with several pitches for test coupons. Decreases error rate of impedance measurements. Can be connected to impedance-check TDR systems. Switching probe signals the start of the measurement and connected TDR software automatically takes and stores the measurements. Setup can be used for other impedances.

Ingun, www.ingun.de

JBC Touch soldering station has a high-resolution touch screen display and menu interface. Can be linked to an Ethernet network and connected to a microscope for viewing on soldering station’s 3.5" screen.

JBC Tools, www.jbctools.com

The DT series printed circuit board enclosure and header are designed to maintain the integrity and continuity of data and power signals in harsh environments; withstand dust, dirt, moisture and vibration. Thermoplastic enclosure accommodates a 5" x 6.5" PCB and features through-hole mounting flanges. Environmentally sealed snap in header features 90° molded in pins that mate with standard DT series plugs. Header is available in 12, 24, 36 or 48 cavity arrangements that accept size 16 contacts and 14-20 AWG wire.

LADD Industries, www.laddinc.com

3D inline x-ray system is available in X3 universal standard system and X3+, with triple detector setup. Both are based on the hardware concept of X2.5. 3D-Software uses a dedicated number of angle projections for 3D reconstruction; delivers 3D slice images needed for solder joint analysis. With algebraic reconstruction method, it is possible to generate high-resolution images for a reliable analysis with only a few projections. Analyze double-sided boards with high packing density. Generated slice images allow a separate 3D analysis for both sides of the board. Include inspection of high power components with heat sinks, where single contact layers can be separated for void or solder wetting analysis; a multilayer analysis of a solder joint is possible with digital 3D tomosynthesis. Use MIPS platform with links to all MIPS software modules for programming, classifying and verification.

MatriX Technologies, www.m-xt.com

Custom SMT pick-and-place nozzles for Cree XLamp XP-E high-efficiency white LED components reportedly reduce LED count by 50%. Designed to avoid placing mechanical stress on LED lens by not touching optical surface during component picking or placement processes. Can be applied to any style pick-and-place nozzle.

Count On Tools, www.cotinc.com 

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