DE 440 three-stage reflow oven is equipped with integrated heating and cooling plates that can be individually controlled. Temperature is controlled by a 3.5-digit microprocessed controller with a PID system. Is designed for volume production with various materials; works at up to 500°C. Designed to run flux-less and void-less soldering processes with various gas atmospheres as N2 and N2H2. Plate size is 486mm x 486mm.

ATV Technologie, http://www.atv-tech.de/en/p05-3-stage-vacuum-reflow-oven.html

SI-G200 high-speed mounter has a placement tact time of 0.08 sec. Is a two-head model: high-speed head and multifunction head; uses one head for placement and the other for pickup. High-speed head places up to 45,000 components per hr.; placement precision is 45μm (Cpk 1 or greater); component size ranges from 0402 up to a 12mm² (movable camera) and 6mm² to 25mm² (fixed camera). Multifunction head has a placement tact time of 0.16 sec./2 heads (22,500 CPH); placement precision  is 50μm (Cpk 1or greater) (individual recognition) and 60μm (Cpk 1or greater) (collective recognition); component size ranges 01005 to 100mm x 50mm.

Sony, http://www.sonysms.co.jp/language/English/product/SMT/Mounter/SI-G200.html

M40 solder pastes are low silver for reduced cost lead-free soldering. Is said to maintain workability of higher silver pastes and overcome reduction in thermal fatigure resistance. Is said to prevent tombstoning and limit solder surface glare. Solidus temperature is 211C, peak temperature is 222C. Is a SnAg1.0Cu0.7Bi1.6 alloy. Halogen-free version available.

Senju Metal, www.senju-m.co.jp/en/product/ecosolder/halogenfree/index.html

Advantis 3 AC-90T high-speed placement platform comes with three 30-spindle Lightning heads to improve line output. Features a triple-beam, dual drive overhead gantry, and on-the-head vision. Reportedly places up to 100,000 cph.

Universal Instruments, www.uic.com