HANZA Group is pleased to introduce Tom Dahlén as our new Group Sales Director.

Tom joined HANZA on September 1, after over 20 years in different managerial positions at Arrow Electronics.

“Constant development is my driver, and I am excited to now be part of HANZA – a modern and fast-growing company with a great business concept. I look forward to meet and connect with you all in the very near future.”

SANTA CLARA, Calif., Oct. 4, 2022 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced it has completed the first phase of its plan to expand its die bonding services. The company has installed a new 2200 evo plus die bonder from BE Semiconductor Industries (Besi) on its production line, adding significant capacity, as well as enhanced accuracy, productivity and flexibility for customer projects targeting a range of key end markets, including medical, biotech and automotive.

The state-of-the-art 2200 evo plus joins Promex’s existing lineup of die bonders, including three additional Besi systems. The robustness and life expectancy of Besi tools, together with new capabilities integrated into the now fourth generation of the 2200 evo plus, contributed to its selection.

Chief among the benefits offered by the 2200 evo plus is its tremendous flexibility and the ability to deliver die attach, flip-chip and multi-chip capability in a single unit. It features an integrated dispenser for direct placement when performing die attach, and its advanced pick-and-place head enables the system to pick components directly from a wafer on tape or a waffle pack and place them as needed for the application.

Another key feature of the evoplus is its optional heated bond head and stage, contributing to its ability to accommodate a variety of substrates and materials, including die attach film (DAF). DAF has become essential in the heterogeneous integration (HI) era for use in wafer prep and singulation of wire-bonded single and multi-chip stacked die solutions. As HI applications involve combining electronic and non-electronic components, the new equipment is also highly capable for assembly of photonic and optical devices.

“Promex is a longtime customer, and their selection of our newest 2200 evo plus multi chip die bonder highlights the strength of our ongoing relationship and the confidence they place in our technology,” stated Hannes Hundsbichler, director for the Multi Chip Die Bonding product line with Besi. “We are proud to serve as one of their trusted suppliers.”

“Our Besi units have consistently delivered excellent results,” said Chip Greely, vice president of engineering for Promex. “With the addition of the 2200 evo plus system, we see great opportunity to secure a broader range of advanced die bonding projects from both new and existing customers.”

About Promex.

Promex Industries, Inc. specializes in advanced design, packaging and assembly services for key subsystems used in a wide range of applications, such as optical, photonics, diagnostics, life sciences, medical and MEMS devices. The company is skilled at heterogeneous integration of tiny components with unique functionality and complex, custom or detailed assembly requirements. Founded in 1975, Silicon Valley-based Promex provides design-for-manufacturing services coupled with materials science expertise and broad assembly capabilities for small- to mid-volume onshore production. Services include RoHS-optimized SMT, wafer thinning, dicing, wire bonding, flip chip, and combining microelectronic and non-microelectronic components, provided in the company's Class 100/Class 1000 cleanrooms. Promex holds a CA FDB license and is ISO 13485:2016 and ISO 9001:2015 certified, IPC certified and ITAR registered. https://promex-ind.com/

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(2022-09-30) Kitron has entered into a production agreement with Ferroamp, a rapidly growing Swedish greentech company. The value of the agreement is expected to reach approximately NOK 90 million in 2023 and NOK 350 million over a three-year period.

Ferroamp has developed EnergyHub, a system that controls electricity use using a patented DC technology, so that property owners can get more out of their solar panels and integrate electric car charging and energy storage. During the first half of 2022, Ferroamp increased its sales by 60 percent and is now planning an international launch.

“Ferroamp continues to expand its operations through collaborations with strategic partners. We are delighted to have signed an agreement with Kitron, which has a leading position in electronics production and has the capacity to produce large volumes of EnergyHub systems for our residential customers,” says Krister Werner, CEO of Ferroamp.

The EnergyHub system is available for both commercial properties and multi-family buildings, with EnergyHub Wall 14 being specifically adapted to residential systems. Through the collaboration with Kitron, Ferroamp triples the production of EnergyHub Wall 14.

“We are very happy that Ferroamp has chosen Kitron as a manufacturing partner to enable its strong growth journey. For a few years now, Kitron has invested heavily in meeting the sharply increasing demand within the Electrification market, and we are well positioned to meet that demand. Signing a long-term partnership agreement with Ferroamp, a market leader in the integration of local power grids, is a great recognition,” says Kristoffer Asklöv, COO of Kitron.

The production for Ferroamp will take place at Kitron's facility in Poland and is expected to start within a few weeks.

For further information, please contact:

Peter Nilsson, President and CEO, tel. +47 94 84 08 50

Kristoffer Asklöv, COO, tel. +46 76 768 29 10 68

E-mail: investorrelations@kitron.com

Kitron is a leading Scandinavian electronics manufacturing services company for the Connectivity, Electrification, Industry, Medical devices and Defence/Aerospace sectors. The group is located in Norway, Sweden, Denmark, Lithuania, Germany, Poland, the Czech Republic, China

Indium Corporation is pleased to announce that Nate Discavage has joined the company as a talent acquisition supervisor.

In this role, Discavage is responsible for developing improvements for recruiting and attracting top talent, engaging in strategic community outreach activities to develop contact with groups and organizations. He also manages Indium Corporation’s award-winning internship program, and implements diversity recruiting strategies consistent with Indium Corporation’s affirmative action plan and objectives.

Prior to joining Indium Corporation, Discavage was a recruiter at the Resource Center for Independent Living (RCIL). During his time with RCIL, he helped rebuild their recruitment approach, adding structure and processes to streamline the hiring timeline and ensure a positive candidate experience.

Nate earned a bachelor’s degree in journalism and mass communications from St. Bonaventure University. He currently serves on the City of Utica’s Access & Inclusion Committee.

About Indium Corporation

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com