Carlsbad, CA USA – October 2022 - Nordson TEST & INSPECTION, a division of the Nordson Corporation (Nasdaq: NDSN), announced that VAS Engineering has successfully installed an Assure FLEX Component Counter and has seamlessly integrated it into their inventory management process. VAS Engineering has provided San Diego with quality contract manufacturing services for the electronics industry since 1987.

Raj Vora, Manufacturing Engineer for VAS, stated “Counting components automatically is becoming the standard in recent years. Tying the entire inventory process together by linking the Assure FLEX to automated storage towers like the JUKI ISM, dynamic shelving and an ERP system is the next level, and that is what we have accomplished here at VAS Engineering over the past year. The total solution between the two companies gives us peace of mind and complete control over 100% of our inventory from incoming, to end of life. Since the beginning of this integration, it has drastically reduced any line-down time caused by running out of components unexpectedly.”

The Assure FLEX includes an internal conveyor system, built specifically to integrate directly into an inventory management system, standard conveyors, or other robotic loading mechanisms. “It is truly one of a kind and opens up many opportunities to improve inventory control,” stated Todd O’Neil, Business Development Manager at Nordson Test & Inspection. In addition, he stated, “It also gives us an opportunity to work closely with other suppliers to offer the best solution at each factory, so they feel they are getting the best of everything.” It is the only X-ray component counter in the world that can be controlled directly from such systems. The Assure FLEX can be configured in such that it is “hands-off”, not requiring any operator involvement for counting. The Assure FLEX also can be used as a standard stand-alone machine for quick counts of reels.

VAS circuit boards travel 20,000-ft below sea level, 30,000-ft in the sky, and everywhere in between. VAS Engineering’s ISO 9001:2015 Certification, combined with its state-of-the-art manufacturing equipment and dedicated staff, allow the company to provide high quality service and quick turnaround on orders while maintaining a competitive edge. The tremendous growth that VAS Engineering has experienced is a direct result of its dedication to providing customers with quality products and outstanding service with on-time delivery.

For more information about VAS Engineering, visit www.vasengineering.com.

For more information about the Assure FLEX E or to schedule a demo today, contact Todd O’Neil at todd.oneil@nordson.com or visit www.nordson.com/en/divisions/dage/x-ray-counting-systems.

About Nordson Test & Inspection

Nordson TEST & INSPECTION offers its customers a robust product portfolio, including Acoustic, Optical, Bondtest, Manual X-ray, Automatic X-ray InspectionI, Assure, and Nordson X-ray Technologies. Nordson TEST & INSPECTION is uniquely positioned to serve its customers with best-in-class precision technologies, passionate sales and support teams, global reach, and unmatched consultative applications expertise.

About Nordson Corporation

Nordson Corporation is a global designer and manufacturer of innovative precision technologies for critical customer applications in consumer, medical, electronics and industrial end markets. The company’s products are supported by application expertise and direct global sales and service. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in nearly 40 countries. Visit Nordson on the web at www.nordson.com, www.twitter.com/Nordson_Corp or www.facebook.com/nordson.

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Indium Corporation is pleased to announce two new additions to its Engineered Solder Materials (ESM) team—Igor Faleichik, senior product specialist, and Jim McCoy, product specialist.

Faleichik assumes responsibility for creating, driving, and supporting initiatives to grow his product lines, with a focus on the connector and RF infrastructure markets for ESM. He researches and analyzes customer and market data for his respective products to understand market trends and technical inflection points. He also supports current and prospective business while serving as a product line resource to coordinate activities among internal departments, including sales, manufacturing, quality assurance, and research and development to advance product growth.

Faleichik brings more than 10 years of industry experience to his new role. He previously served as a sales manager, business development manager, and a marketing consultant—roles that have allowed him to cultivate and nurture strategic business partnerships and develop targeted business initiatives. Most recently, he served as president of an infrared optical component manufacturer.

Faleichik holds both a bachelor’s degree and a master’s degree in marketing from Siberian State Aerospace University. He holds a business certificate in First Principles of Computer Vision from Columbia University, is a certified associate in project management, and is a Certified Lean Six Sigma Yellow Belt.

McCoy is responsible for researching and aligning customer needs with product capabilities to facilitate current and prospective business within the Engineered Solder Materials segment. His focus is on solder preform technology for power electronics applications and he serves as a product line resource to customers and internal departments to address the growing market.

McCoy joined Indium Corporation in 2014 as a talent acquisition coordinator and was promoted to a supervisor role in 2017. During his time with the human resources department, McCoy developed close working relationships with hiring managers and many other members of the community. He was instrumental in creating, developing, and leading Indium Corporation’s award-winning summer college internship program.

McCoy holds a bachelor’s degree in business administration from Western New England University and an MBA in technology management from the State University of New York Polytechnic University. He is a Lean Six Sigma Yellow Belt and a graduate of the Dale Carnegie Leadership Skills for Success program.

About Indium Corporation

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.

HANZA Group is pleased to introduce Tom Dahlén as our new Group Sales Director.

Tom joined HANZA on September 1, after over 20 years in different managerial positions at Arrow Electronics.

“Constant development is my driver, and I am excited to now be part of HANZA – a modern and fast-growing company with a great business concept. I look forward to meet and connect with you all in the very near future.”

SANTA CLARA, Calif., Oct. 4, 2022 – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced it has completed the first phase of its plan to expand its die bonding services. The company has installed a new 2200 evo plus die bonder from BE Semiconductor Industries (Besi) on its production line, adding significant capacity, as well as enhanced accuracy, productivity and flexibility for customer projects targeting a range of key end markets, including medical, biotech and automotive.

The state-of-the-art 2200 evo plus joins Promex’s existing lineup of die bonders, including three additional Besi systems. The robustness and life expectancy of Besi tools, together with new capabilities integrated into the now fourth generation of the 2200 evo plus, contributed to its selection.

Chief among the benefits offered by the 2200 evo plus is its tremendous flexibility and the ability to deliver die attach, flip-chip and multi-chip capability in a single unit. It features an integrated dispenser for direct placement when performing die attach, and its advanced pick-and-place head enables the system to pick components directly from a wafer on tape or a waffle pack and place them as needed for the application.

Another key feature of the evoplus is its optional heated bond head and stage, contributing to its ability to accommodate a variety of substrates and materials, including die attach film (DAF). DAF has become essential in the heterogeneous integration (HI) era for use in wafer prep and singulation of wire-bonded single and multi-chip stacked die solutions. As HI applications involve combining electronic and non-electronic components, the new equipment is also highly capable for assembly of photonic and optical devices.

“Promex is a longtime customer, and their selection of our newest 2200 evo plus multi chip die bonder highlights the strength of our ongoing relationship and the confidence they place in our technology,” stated Hannes Hundsbichler, director for the Multi Chip Die Bonding product line with Besi. “We are proud to serve as one of their trusted suppliers.”

“Our Besi units have consistently delivered excellent results,” said Chip Greely, vice president of engineering for Promex. “With the addition of the 2200 evo plus system, we see great opportunity to secure a broader range of advanced die bonding projects from both new and existing customers.”

About Promex.

Promex Industries, Inc. specializes in advanced design, packaging and assembly services for key subsystems used in a wide range of applications, such as optical, photonics, diagnostics, life sciences, medical and MEMS devices. The company is skilled at heterogeneous integration of tiny components with unique functionality and complex, custom or detailed assembly requirements. Founded in 1975, Silicon Valley-based Promex provides design-for-manufacturing services coupled with materials science expertise and broad assembly capabilities for small- to mid-volume onshore production. Services include RoHS-optimized SMT, wafer thinning, dicing, wire bonding, flip chip, and combining microelectronic and non-microelectronic components, provided in the company's Class 100/Class 1000 cleanrooms. Promex holds a CA FDB license and is ISO 13485:2016 and ISO 9001:2015 certified, IPC certified and ITAR registered. https://promex-ind.com/

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