Press Releases
ALZENAU, GERMANY – Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase its award-winning inspection solutions at electronica on 15-17 November 2022 in Munich, Germany. We will present our innovative technologies to a global audience at this leading tradeshow in booth A3.358. Additionally, Koh Young is sponsoring the Advanced Packaging Conference, which event organizers are holding in conjunction with electronica. This technical conference is an important forum for discussing the latest developments in packaging technology. We look forward to meeting you at electronica 2022 and sharing our latest innovations with you.
If you are looking for the latest in conformal coating inspection technology, you will want to check out Neptune C+ and the Neptune T at our booth. Our award-winning technology is sure to be one of the company's highlights.
Neptune C+
Most optical systems use UV light to inspect the surface for presence and gauges to measure material thickness in a particular spot, which does not provide the accuracy and repeatability needed. Inspecting transparent materials proved to be a challenge for traditional laser-confocal or electron microscope systems that only measure three-dimensional shapes. Koh Young’s revolutionary Neptune C+ delivers the ultimate solution to these challenges.
Neptune T
The Neptune T is the world's first 3D optical measurement instrument for transparent materials. It is available for coating, underfill, epoxy, glue, and bonding material inspection. With its patented L.I.F.T. technology, the Neptune T provides accurate thickness measurement of even the most transparent materials. The system allows manufacturers to explore depths of its process and accurately identify defects with 2D, 3D, and cross-section views.
Koh Young offers a full range of inspection solutions for advanced packaging and mini- and micro-LED applications. You can learn more about these innovative systems and our multiple industry awards by visiting our booth A3.358.
Meister D
The Meister D is a perfect solution for production-speed 3D inspection of die and small MLCCs using an integrated measurement tool with defect analysis software based on advanced optics and AI engines. The system inspects micro cracks, chips, foreign material, and more.
Meister S
The Meister S has been qualified for mass production by major semiconductor foundries and Mini/Micro-LED companies for micro solder inspection with superior full 3D inspection performance. Combining innovative vision algorithms and high-resolution optics, the Meister S goes beyond micro solder paste inspection, but also a proven solution for Flux inspection.
Additionally, we will present our flagship AOI (Zenith 2) and SPI (aSPIre 3) to show attendees. We offer the opportunity to discover the industry´s best performing True 3D inspection solutions.
Zenith 2
The AOI sets new standards with novel SMT process management tools by combining advanced vision algorithms with innovative high-resolution optics, allowing a wider inspection coverage including advanced tall component inspection. The Zenith 2 delivers clear and concise AOI measurement to accurately identify multiple defects such as missing solder, offset, polarity, upside down, OCV/OCR, solder fillet, billboarding, lifted lead, lifted body, tombstone, bridging, and more.
aSPIre 3
The SPI delivers the highest standard in the metrology- level True 3D SPI market, ensuring incomparable performance for the most demanding applications. The inspection system uses our AI platform for print process optimization with the award-winning Koh Young Process Optimizer (KPO).
If you cannot attend the tradeshow, you can learn more about Koh Young and its best-in-class inspection solution technologies, including our updated website at www.kohyoung.com.
About Koh Young Technology, Inc.
Established 20 years ago in 2002, Koh Young pioneered the market by launching the first 3D Solder Paste Inspection (SPI) system using a patented dual-projection Moiré technology. Since then, it has become the global leader in 3D measurement-based SPI and Automated Optical Inspection (AOI) equipment for the electronics industry. Based on its True3D™ measurement-based inspection technology, Koh Young has developed innovative inspection solutions for challenges with machined parts, press-fit and through-hole pins, conformal coatings, dispensed materials, and semiconductor packages. Through its constant innovation, Koh Young has secured over 3,500 global customers, and maintains the dominant global market share in the SPI and AOI markets with over 20,000 machine installations. By adopting a user-centric R&D focus, it continues to use its core competencies to develop innovative solutions for new and existing markets. Its activities stem from the corporate headquarters in Korea to its global sales and support offices in Europe, Asia, and the Americas. These local offices ensure it stays close to the market, and more importantly, its growing customer base. Learn why so many electronics manufacturers trust Koh Young for reliable inspection for a smart factory at www.kohyoung.com.
For More Information
Koh Young Technology, 14F Halla Sigma Valley, 53 Gasandigital 2-ro, Geumcheon-gu, Seoul, Korea 08588 marketing@kohyoung.com or www.kohyoung.com
FREMONT, CA — VVDN Technologies, a global provider of engineering, and digital services and solutions, today announced it has entered into a multi-year global strategic partnership with Google Cloud. The partnership will help customers accelerate app modernization and cloud transformation. VVDN will also develop the next generation of innovative solutions, namely IoT and Video Cloud Platform, and a NextGen Enterprise Private 5G Cloud, etc., through this new partnership with Google Cloud.
Through this partnership, VVDN’s enterprise customers will gain greater financial flexibility, and the ability to accelerate their cloud migrations and modernize their enterprise applications on Google Cloud. Once on Google Cloud, customers will be able to immediately begin creating hybrid applications that enable businesses to be more agile, with more secure access to Google Cloud services like BigQuery and Cloud Operations, and extend their existing disaster recovery, backup, and storage services.
Furthermore, VVDN and Google Cloud are setting up a joint CoE to work on IOT, Video Cloud, and Enterprise Private 5G Cloud.
In the IoT and Video Cloud space, VVDN is developing a SaaS-based Device Agnostic IoT Cloud solution with Google Cloud for onboarding smart devices, cameras, and more. The solution is based on a scalable and secure architecture that can be delivered for multiple applications and serve a variety of use cases. Building blocks are engineered to accelerate deployment for multiple industries including IoT, Security and Surveillance, Automotive, Networking and Wireless, and more.
As part of a wider 5G strategy, VVDN aims to bring its respective 5G expertise and become an end-to-end Enterprise Private 5G provider with Google Cloud. VVDN 5G Cloud services include: end-to-end service orchestration, VNF optimization, CI/CD and automation, network performance testing, Automation framework development, and application development (i.e Network Management System).
Vivek Bansal, President Engineering, VVDN Technologies: “We are really excited about our newly announced partnership with Google Cloud. This partnership will act as a catalyst for VVDN’s growth and will enable us to scale our customers with the help of Google Cloud’s infrastructure. This joint CoE between VVDN Technologies and Google Cloud will allow us to innovate and build advanced technologies which will be a key driver in our growth. Through this partnership, we aim to develop solutions for IoT, Video, and 5G Cloud Platforms which are in demand.”
“Enterprises around the world are realizing the benefits of adopting cloud technologies in the IOT and private 5G space." said Majed Al Amine, Head of 5G & Edge Telecom Industry Solutions, Google Cloud. "We’re proud to support VVDN's commitment to innovation and are excited to move forward in our journey together."
MINNEAPOLIS, MN – SMTA is pleased to announce Emily Williams, Lorain County Community College, has been selected as the recipient of the 2022 JoAnn Stromberg Student Leader Scholarship.
The SMTA Awards Committee selected Emily for her committed leadership in the SMTA. Emily is currently enrolled in the Micro Electromechanical Systems (MEMS) program at Lorain County Community College. She holds the Student Leader role for the SMTA Ohio Valley Chapter, serving as an advocate for local college students. Upon completion of her studies, Emily would like to work as a professional researcher at the NASA Glenn Research Center in Cleveland, Ohio, where she could contribute towards the advancement of technology in various fields of research.
The $3000 JoAnn Stromberg Student Leadership Scholarship, given in honor of the nearly 30 years of service dedicated by former Executive Administrator, JoAnn Stromberg, was established following her retirement in 2015. The purpose of this scholarship is to encourage students to take on more leadership opportunities and strengthen the connection between students and the electronics industry.
The Stromberg Scholarship is awarded annually to a student pursuing a degree in electronics and actively involved in the SMTA. The scholarship is intended for the purchase of technical books and research materials, for participation in conferences related to electronics assembly and packaging, and for living expenses if necessary.
The award will be presented in person at the 2022 SMTA International Conference, October 31 - November 3, 2022 in Minneapolis, MN.
The nomination period will be available early next year for 2023 candidates. Consider making a donation to the scholarship by visiting https://www.smta.org/scholarship/.
Please contact Saniya Pilgaonkar, scholarship@smta.org or +1-952-920-7682, with questions.
SMTA – A Global Association Working at a Local Level
SMTA is an international network of professionals who build skills, share practical experience and develop solutions in Electronics Manufacturing (EM), including microsystems, emerging technologies, and related business operations.
NASHVILLE — KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, is pleased to announce that the SMTA has honored Sherry Stepp, Global Marketing Manager, with a 2022 Members of Distinction Award. Stepp was chosen for an Excellence in Leadership Award. Recipients of the Members of Distinction awards are selected for showing exceptional dedication to the association and the electronics manufacturing industry.
The Excellence in Leadership Award honors strong leaders who continue to support and elevate the association. Stepp has been an advocate for the SMTA on a national, international, and most recently at the local level.
Since she joined SMTA in 2009, Stepp has been an important voice with the Marcom Committee, the Women’s Leadership Program and the Expos Committee. Since 2020 she took on leadership roles with her local Huntsville chapter, first as President and most recently as VP of Membership.
SMTA is an international network of professionals who build skills, share practical experience and develop solutions in Electronics Manufacturing (EM), including microsystems, emerging technologies, and related business operations. The association has recognized exceptional individual and corporate members for their immeasurable contributions to the association since 1994.
As KYZEN’s Global Marketing Manager, Stepp has been with the company for more than 25 years. KYZEN connects leading science with care to create the most effective cleaning solutions for each customer’s unique manufacturing process or problem. For more information about KYZEN, or to ask specific technical cleaning questions, visit www.kyzen.com.
About KYZEN
KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, visit www.kyzen.com.
Indium Corporation Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, will be part of a panel presentation at the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) conference in Taipei, Taiwan on Oct. 27. The presentation will cover the findings from a technical paper titled The Effects of Voids on Solder Joint Reliability in First Level Interconnect.
First level interconnect (FLI), e.g., flip-chip attach on substrate or wafer, using solder as the interconnect material, is employed extensively in advanced packaging assembly. During the flip-chip die-attach process, some voids are often formed in the solder joints. In the past, this may not have been seen as a major issue since the voiding percentage is typically less than 10%; however, as miniaturization continues, the solder joint of FLI is becoming smaller (<100µm bump or Cu pillar size) with tighter pitch and higher density, there is an increasing concern with how the micro voids in the solder joint will affect the package’s long-term reliability even though the void percentage is not excessive. This paper will describe the details of the different test conditions, and discuss observations from the failure analysis done with cross-sections and electron backscatter diffraction (EBSD) analysis.
As Senior Global Product Manager for Semiconductor and Advanced Materials, Lim works closely with R&D and manufacturing, and engages with the world’s leading semiconductor companies and contract manufacturers. She is a task force member of the International Electronics Manufacturing Initiative (iNEMI) Packaging Technology Integration Group and has co-chaired a number of industry projects and road-mapping initiatives over the past five years. She is also on the executive committee of the Institute of Electrical and Electronics Engineers (IEEE) Packaging Society, Malaysia Chapter. Lim is a part of the organizing committee for the International Electronics Manufacturing Technology (IEMT). She has authored a number of technical papers and presented regularly in various international technical conferences. She holds a bachelor’s degree from the National University of Singapore, where she majored in industrial chemistry with a focus in polymers. She is a Certified SMT Process Engineer and has earned her Six Sigma Green Belt designation.
About Indium Corporation
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
Tokyo, Japan – Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, has been chosen for Infineon’s ‘High Power Equipment Supplier’ award. Saki’s X-ray inspection machines are a key system for quality control in Infineon’s manufacture of insulated gate bipolar transistor (IGBT) power modules, and it is honored to receive this award in acknowledgement of the exceptional logistics and performance work achieved in this ongoing partnership.
With its AXI central to Infineon’s inspection process and quality assurance, Saki is pleased to receive this annual award, reflecting the dedication of its team as well as the reliability of the hardware itself.
Saki was delighted to attend Infineon’s event and ceremony in Kuala Lumpur to receive the recognition of its work. There, Eddie Ichiyama, Saki’s Chief Sales Manager - Overseas, accepted the award, saying, “It is an honor to receive Infineon’s award for our continued improvements in the field of power semiconductor manufacture. Saki has advanced the technology in the essential arena of quality assurance and inspection, and is proud to be recognized with this award.”
For further information about Saki, visit www.sakicorp.com/en/.
