AUSTIN, TX — TechSearch International’s latest report: 2022 Flip Chip and WLP: Trends and Market Forecasts examines the impact of slowing consumer demand on the flip chip and WLP market growth. The report includes an examination of both fan-in WLP and fan-out WLP markets. The report also examines bump pitch trends and the role of hybrid bonding.

Chiplet architectures are increasingly being adopted to achieve the economic advantages lost with the high cost of silicon scaling on advanced nodes. With chiplet designs, more silicon is needed to support the disaggregation of the monolithic die into smaller intellectual property (IP) building blocks. Many devices have made the conversion from solder bumps to Cu pillar. FO-WLP processes in production using the Deca M-SeriesTM and TSMC’s InFO use a Cu pillar on the native wafer. Reduced demand for smartphones and PCs this year is changing demand for flip chip packages, but growth will continue. The compound annual growth rate (CAGR) for all types of flip chip devices in units from 2021 to 2026 is 4.5 percent. This includes both solder bump and Cu pillar. Industry-wide capacity utilization was extremely high last year, but has decreased more than 10 percent this year. With continued capacity expansion, utilization will not reach levels seen in 2021 over the next several years.

Despite lower demand for consumer products such as smartphones, Fan-in WLP shipments will increase this year because of continued growth in image sensor demand, particularly for surveillance cameras in China. The WLP count continues to climb for most products. In a few cases, WLP counts have declined in products due to higher levels of integration. The projected CAGR from 2021 to 2026 in units is 7.83 percent. Devices using FO-WLP include application processors, RF, PMICs, audio CODEC, envelope trackers, automotive radar, and some image sensors. Single die are common and multi-die configurations are increasing. A 6.3 percent CAGR in units is projected for 2021 to 2026. Several companies are researching, developing, or installing panel-based production lines. A variety of approaches for large-area production have been developed. No consistent method or panel size has emerged, but several companies have adopted panel sizes of 600 mm x 600 mm. While applications for panels include some portion of the reconstituted wafer market, new applications such as power devices are emerging.

The latest analysis is a 106-page report with full references and an accompanying set of ~140 PowerPoint slides. TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 22,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch at tel: 512-372-8887 or see www.techsearchinc.com. Follow us on LinkedIn.

WINDSOR, COLO. (PRWEB) NOVEMBER 15, 2022-- Today, Snaptron announced the release of its first surface-mount metal dome, the S-Series, also known as a surface-mount device (SMD) dome. Snaptron’s S-Series domes are standard four-leg metal dome switches with two solderable tabs. The tabs allow the dome to be soldered directly to a printed circuit board or flex circuit without impacting performance. Like traditional tactile domes, the solder dome is a normally open momentary contact that provides crisp tactile feedback, letting the user know a button was pressed.

Traditional methods of adhering metal domes to the circuit board require adhesive tape or placement into spacer pockets. This process is typically done semi-automatically or manually and requires an assembler. A significant benefit of a solder dome is the ease of assembly and the ability to use existing surface mount technology (SMT) equipment to place these domes. This solution takes the time and cost of manual labor out of the equation.

The solder dome has a higher life cycle rating than most tact switches. For example, tact switches are typically rated to 500,000 cycles, while the solder dome is rated to 1,000,000 cycles–ideal for applications with long life requirements. The solder dome also has a much lower profile and better travel and tactile feel—giving it a distinct advantage over solderable tact switches. As a result, SMD domes are a viable alternative to tact switches.

The solder dome allows customers to easily integrate dome placement in their existing SMT systems or normal automation processes. The solder dome is loaded into tape and reel and attaches to the circuit board using the reflow soldering method, just like standard SMD components. As a result, the solder dome can reduce labor costs, accelerate production, and eliminate steps to final assembly. Because of this, the solder dome is often a go-to solution for high-volume projects.

“A dome that can be soldered directly to the circuit board has been a highly sought-after solution by our customers,” said Ashley Steinbach, Director of Strategic Development at Snaptron. “We’re excited to bring this product to the market and offer our customers a switch that can be soldered in the assembly line, like any other component.” Steinbach continues, “Once the S-Series is fully released, we expect to double our volumes and see this product significantly impacting the tactile switch market.”

Snaptron’s solder dome is now available for purchase in 6.3mm size. Snaptron will release numerous other sizes of the solder dome in the coming months. Contact Snaptron to learn about custom options. Visit Snaptron’s website to learn more about the S-Series: https://www.snaptron.com/

About Snaptron

Snaptron is the leading global manufacturer and distributor of tactile metal dome switches and related placement and test equipment. Founded in 1990, Snaptron is a manufacturer based in Windsor, Colorado, that’s committed to providing the highest quality metal domes or dome arrays–100% made in the USA. With more than 100 years of combined experience, our team of experts can customize any dome switch to your requirements.

CAMBRIDGE, England & EINDHOVEN, Netherlands--(BUSINESS WIRE)--Cambridge GaN Devices (CGD), the fabless, clean-tech semiconductor company that develops a range of energy-efficient GaN-based power devices to make greener electronics possible, and Neways Electronics (Neways), the international innovator in electronics for smart mobility, semiconductor and connectivity solutions, will sign an agreement to develop high efficiency, photovoltaic solar inverter products based on gallium nitride technology at Electronica 2022.

“Neways and CGD are perfectly aligned in our commitment to a sustainable future based on clean tech energy. We believe that this program to jointly develop photo-voltaic products that lead the world in terms of efficiency and performance will move the market forward and contribute to a better world.”

“Neways and CGD are perfectly aligned in our commitment to a sustainable future based on clean tech energy. We believe that this program to jointly develop photo-voltaic products that lead the world in terms of efficiency and performance will move the market forward and contribute to a better world.”

“Neways is committed to working with like-minded innovative companies to bring state-of-the-art, sustainable energy solutions to the market. The combination of Neways’ extensive systems experience and CGD’s high-efficiency, rugged and simple-to-use GaN devices is a perfect fit for this application.”

The partnership, which was forged after the two companies met while collaborating on the European-funded GaNext project, has already borne fruit. At Electronica, both on the Neways booth, and at CGD’s booth (Hall C3, Booth 535), visitors will be able to see a demo of a 3kW photovoltaic inverter jointly developed by the two companies. Using eight CGD65A055S2 GaN transistors, this transformer-less, ultra compact design achieves a power density of 1kW/L. With a Vin of 150-350VDC, a Vout of 230VAC and a switching frequency 350kHz the design has a maximum efficiency of 99.22%.

About Cambridge GaN Devices

Cambridge GaN Devices (CGD) is a fabless semiconductor company spun-out by Professor Florin Udrea and Dr Giorgia Longobardi from Cambridge University in 2016 to exploit a revolutionary technology in power devices. Our mission is to shape the future of power electronics by delivering the most efficient and easy-to-use transistor. CGD designs, develops and commercialises GaN transistors and ICs enabling a radical step change in energy efficiency and compactness and is suitable for high volume production. CGD’s ICeGaN™ technology is protected by a strong IP portfolio which constantly grows based on the company's leading innovation skills and ambitions. In addition to the multi-million seed fund and Series A private investments, CGD has so far successfully secured four projects funded by iUK, BEIS and EU (Penta). The technical and commercial expertise of the CGD team combined with an extensive track record in the power electronics market has been fundamental in early market traction of its proprietary technology.

About Neways

Neways is an international innovator in electronics for smart mobility, connectivity and semicon solutions. With more than 50 years’ experience and strong engineering power, we are proud to act as technology innovation partner for the most demanding customers in the industry. Neways develops and produces electronics that facilitate major trends around global ESG themes. Our team of more than 2,500 specialists across the Netherlands, Germany, USA, China, Czech Republic and Slovakia enables future solutions for EV charging, electric power trains, digitizing health solutions, sustainable agriculture, producing microchips and more. www.newayselectronics.com

Pulsar solderability test system determines how well molten solder will wet on solderable surfaces of electronic components.

Newman Lake, WA (November 15, 2022) – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Pacific Component Xchange, Inc. has purchased a Pulsar solderability test system. The Pulsar utilizes the highly proven dip-and-look test method that is a qualitative type test performed by comparative analysis after specimens are dipped in a bath of flux and molten solder. An advantage of the dip-and-look method is since it is based on comparative analysis it can be performed rapidly by shop floor personnel with minimal training as well as requiring significantly lower capital investment then a wetting balance test system. The Pulsar solderability test system complies with all applicable solderability test standards including MIL-STD-883 Method 2003, IPC J-STD-002 and MIL-STD-202 Method 208.

About Pacific Component Xchange

Headquartered in Huntington Beach, California, Pacific Component Xchange, Inc. is a major distributor of electronic components serving customers across America, Europe, and Asia. Their in-house services include global purchasing support, X-ray, XRF, and solder testing, microscopy, and topical chemical analysis. For more information, please visit: www.pcxco.com.

About Hentec Industries

Hentec Industries/RPS Automation is a manufacturer of automated selective soldering, component lead tinning, and solderability test equipment for electronics and electronic component manufacturing, assembly, and distribution. Hentec/RPS has been advancing automated soldering and lead finishing technology for defense, aerospace, automotive, contract manufacturers and micro-electronics component manufacturers since the early 90’s. All Hentec/RPS products are designed and manufactured in Newman Lake, Washington. For more information, please visit us at www.rpsautomation.com.