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FEATURES

  • COVER ARTICLE
    NEMI's Lead-Free Alloy
    Still applicable to today's commercially available alloys.
    Alan Rae and Carol Handwerker

  • AOI Testing Positions in Comparison
    An extensive study compares AOI following printing, placement and reflow, with surprising results.
    Peter Krippner and Detlef Beer
    Note: Click here to read the full version of this article in April's Online Exclusives.

  • Total Process Control and Management, Part I
    From reliability, stability and traceability to predictability.
    Dr. Paul P.E. Wang, Jorge Martinez-Vargas, Dinesh Gill, Ramamoorthy Ganapathy Iyer and Dan Kauss

  • Thermal Repeatability in Lead-Free Array Rework
    A recent study on thermal repeatability shows how even small changes in process variables can have a significant impact on the end result in lead-free array rework.
    Craig Brown

  • Solder Preforms in Circuits Assembly
    New solutions for old problems.
    Mitch Holtzer

PERSPECTIVES

  • Editorial

  • On the Forefront
    Phil Zarrow

  • Standard Features
    Jack Crawford

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The Fine Pitch - Q&A with Raymond P. Sharpe, CEO, Cookson Electronics
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Cover design by Javier Longoria.

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