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  • FOCUS ON: HDI/ADVANCED TECHNOLOGY
    Optimizing Solder Paste for Wafer Bumping
    This investigation examines the variables of wafer bumping using solder paste printing techniques.
    Maureen Brown and Fritz Byle

  • 2-D or 3-D Inspection: Do You Have to Choose?
    Flexibility in x-ray inspection combines 2-D real-time imaging with 3-D axial computed tomography.
    Dr. Udo E. Frank

  • Reliable Solder Joints for 0201s
    A summary of the eutectic and lead-free solder reliability testing that has been performed while developing the 0201 process.
    David Geiger, Mei Wang, Dr. Dongkai Shangguan, Todd Castello and Fredrik Mattsson

  • 2004 Buyer's Guide

PERSPECTIVES

  • Editorial

  • On the Forefront
    E. Jan Vardaman

  • Standard Features
    Jack Crawford

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