BANNOCKBURN, IL – IPC requests abstracts for poster presentations at IPC Apex Expo in San Diego.

Poster presentations are scheduled for Jan. 30 and will be displayed throughout the event.

Technical poster presentations are being sought on relevant electronics topics, including design, materials, assembly, processes and equipment and test, especially 3D printing in electronics manufacturing; automation in electronics manufacturing; adhesives; advanced technology; area array/flip chip/0201 metric; assembly and rework processes; BGA/CSP packaging; black pad and other board-related defect; BTC/QFN/LGA/MLF components; business and supply chain issues; cleaning; conformal coatings; corrosion; counterfeit electronics; design; electromigration; EMS; embedded passive and active devices; environmental compliance; graphene in EMS; Lean Six Sigma; LED manufacturing; failure analysis; flexible circuitry; HDI technologies; head-on-pillow; board and component warpage; high-speed, high-frequency and signal; Industry 4.0; lead-free fabrication; assembly and reliability; miniaturization; nanotechnology; optoelectronics; packaging and components; PCB fabrication; PCB and component storage and handling; quality and reliability; photovoltaics; package-on-package; printed electronics; reshoring; RFID circuitry; robotics; soldering; surface finishes; test, inspection and AOI; tin whiskers; 2.5-D/3-D component packaging; underfills; via plugging and other protection; and wearables.

Submit abstracts to www.IPCAPEXEXPO.org/CFPosters.

The deadline for abstracts of up to 300 words summarizing technical and previously unpublished work covering case histories, research and discoveries is Sept. 21, 2018.

For more information, contact Jasbir Bath at JasbirBath@ipc.org or Toya Richardson at ToyaRichardson@ipc.org.

Register now for PCB WEST, the leading trade show for the printed circuit design and electronics manufacturing industry! Coming Sept. 11-13 to the Santa Clara Convention Center.