EZReball 6,000 ball count BGA preforms consist of 4,000 solder balls on a 0.4mm pitch over a 45mm x 45mm package.

Can be ordered and built in configurations from 6 to 6,000-plus balls. Sizes of the balls range from 10 to 40 mils in solder alloys of Sn63Pb37, SAC 305 and Sn10Pb90. Each is made to order using laser machining.



PCB West Virtual 2020 has more than 125 hours’ worth of technical sessions on printed circuit design and manufacturing available through Oct. 12.  pcbwest.com 


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