E-Z Step stepped stencils are used to facilitate an increase or decrease of paste volume and deposit height on selected printed circuit board areas with mixed component technology, large ground pads, intrusive reflow or coplanarity issues. Step areas are 20 to 150µm with support of complex shapes. Step ramp is in 50µm increments. Positional accuracy is <10µm on step areas. Material thickness is +/-2%.

MET Stencil


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