CLINTON, NY – Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicle manufacturing, at APEC 2023, March 19‒23 in Orlando, Florida.

With its significant automotive industry expertise and an award-winning portfolio of proven products, Indium Corporation will feature:

• InFORMS® are reinforced solder alloy fabrications that improve mechanical and thermal reliability and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
• InTACK™ is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, creating a low-cost tooling-free solution without compromising soldering quality.
• QuickSinter® is a high metal content paste, redefining sinter technology for power electronics. Available in pressureless and pressure formulations, this portfolio of sintering solutions delivers products engineered for customers’ specific application needs.
• Durafuse® HT features a novel design based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys. Durafuse® HT delivers simplified processing, with no special equipment needed, and enhanced thermal cycling reliability equal to or higher than a high-Pb solder.

To learn more about Indium Corporation’s innovative products for EV and power electronics, visit us at booth #859 at APEC or online at indium.com.