Advanced Inspection Systems from MIRTEC at SMTA Guadalajara
September 2019 – MIRTEC, “The Global Leader in Inspection Technology,” will exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 23-24, 2019 at the Expo Guadalajara. The MIRTEC team will showcase the all new MV-6 OMNI 3D AOI Machine and award-winning MS-11e 3D SPI Machine.
The MV-6 OMNI combines MIRTEC’s exclusive 15 Mega Pixel CoaXPress Camera Technology with their proprietary OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology to provide precision inspection of SMT devices on finished PCB assemblies. MIRTEC’s exclusive 15 Mega Pixel CoaXPress Camera System is designed and manufactured by MIRTEC for use with its complete product range of inspection equipment.
MIRTEC’s proprietary Digital Tri-Frequency Moiré Technology, provides superior 3D inspection of SMT and Thru-Hole devices up to 25mm tall. This industry acclaimed technology yields precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured the new MIRTEC MV-6 OMNI machines feature four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera. There is little doubt that this new technology has set the standard by which all other inspection equipment are measured.
MIRTEC’s award-winning MS-11e 3D SPI Machine is configured with an exclusive 15 Mega Pixel CoaXPress Camera System, providing enhanced image quality, superior accuracy and incredibly fast inspection rates.
The MS-11e uses Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11e uses the same robust platform as MIRTEC’s MV-6 OMNI Series.
MIRTEC’s total quality management system software, INTELLISYS® also will be on display at SMTA International. This software suite promotes continuous process improvement by allowing manufacturers to track and eliminate defects on inspected assemblies.
