May 2010 cover

FEATURES

High Thermal Mass, Very High Lead Count SMT Connector Rework Process
Rigorous testing found local vapor phase clearly superior to alternative processes.
by Jim Bielick, Brian Chapman, Mitchell Ferrill, Michael Fisher, Phil Isaacs, Eddie Kobeda and Theron Lewis
New Year, New Outlook
An uptick in attendance on the floor overshadowed a lack of innovations in the booths.
By Mike Buetow and Chelsey Drysdale

FIRST PERSON

 

 

 

EMS hot for LED.

Mike Buetow

FHP Reps’ Keith Favre.

Mike Buetow

Sayonara, electronics engineering?

Pete Waddell

 

MONEY MATTERS

Printed electronics: process revolution?

Randall Sherman

Bad grades.

Peter Bigelow

TECH TALK

Inside the iPad.

E. Jan Vardaman

Post-print inspection.

Dr. Rita Mohanty

Hot solder dip: back in vogue.

Al Cable

Implementing a reflow process.

ACI Technologies Inc.

Solder flooding.

Paul Lotosky

Toward grid parity.

Darren Brown

DEPARTMENTS

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