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Two Worlds Converging: Chipshooting and Flip-chip Bonding

By Eric Klaver and Patrick Huberts

Pick-and-place equipment has over the years mostly evolved in four key areas; it is faster, more reliable, more accurate and more user friendly. Most pick & place vendors have aimed at the mass production market, while others have moved towards more dedicated markets – mostly where production flexibility is needed as with high-mix, prototyping or evaluation. But in the end, we’re all doing the same thing: picking and placing components on bare substrates.

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