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NEVADA CITY, CA – The global market for IC packaging posted a banner year in 2017, and contributed significantly to the semiconductor industry’s strongest growth in more than a decade, according to a new report from New Venture Research.

Year-over-year growth of the semiconductor market was nearly 22%, and revenues climbed to more than $358 billion, while IC packaging grew by 20%, and reached annual revenues of $63.2 billion.

The primary driver for this growth has been the increasing demand for smaller and more highly integrated devices. However, with monolithic semiconductors approaching the limits of Moore’s Law, IC packaging will become increasingly important for the continued growth of the industry, says NVR. Between 2017 and 2022, the share of packaging revenues will rise from 17.7% of the total semiconductor market to more than 20%, and annual revenues will reach nearly $85.7 billion.

The research firm's latest Worldwide IC Packaging Market, 2018 Edition details the trends by delving deeply into the impact of the IC packaging market. The report includes in-depth forecasts of IC packaging solutions, segmented into fourteen packaging families and further analyzed by the number of I/O (input-output) connections integrated into the packages. In addition to the packaging types, the report provides detailed analysis of the total semiconductor market in terms of function, applications and world regions. Altogether, more than 180 tables and figures are provided in the nearly 500 page report.

The report also provides a particular focus on the OSAT market, the outsourced semiconductor assembly and test vendors. This market sector generates more than half of all IC packaging revenues, and its influence is growing stronger every year. It is the fastest growing sector of the market, with annual revenues expected to reach $48.5 billion by 2022.

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