CRANSTON, RI -- AIM Solder today announced the pending release of a new white paper examining the impact of stencil coatings and tension on solder paste print quality on miniaturized components.

The new white paper, authored by technical marketing manager Timothy O’Neill, covers use of Type 4 and Type 5 solder paste powders on coated and non-coated stencil foils at standard and high mounting tensions, and compares release, repeatability and print definition characteristics.

Titled “Evaluating the Impact of Stencil Nano-Coating and Stencil Foil Mounting Tension on Overall Print Quality of Miniaturized Devices,” the paper extends previous work (“The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance”) published at IPC Apex earlier this year.

The study was developed to identify and grade variables that provide the most improvement on solder paste printing outcomes.

O’Neill has over 20 years of experience in the solder assembly for electronics industry, including extensive knowledge with fine pitch solder paste application. He has authored over a dozen industry articles and assisted and solved numerous clients’ production challenges. O’Neill is also a columnist for CIRCUITS ASSEMBLY.

Register now for PCB West, the Silicon Valley's largest trade show for the printed circuit industry, taking place Sept. 13-15 in Santa Clara: pcbwest.com

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