CA-183 low-temperature cure electrically conductive adhesive is designed for die attach and general circuit assembly applications.
Cures in 60 min. at 80°C, 20 min. at 100°C or 30 sec. at 150°C. Has an electrical conductivity of 9 x 10-4 ohm-cm. Is for applications with temperature-sensitive components requiring high conductivity interconnects. Has a 48 hr. work life and a 26,000 cP viscosity at 5rpm for easy needle dispensing or application by pin transfer. Was developed to pass reliability requirements in die attach, disk drive, camera module, photonics and circuit assembly applications.
Engineered Material Systems