caLogo

891 and 893 64-position, 1mm pitch mezzanine connectors are for parallel board stacking interconnections. Surface mount connectors have a mated height of 10mm. Provide high-density packaging. Locating posts are incorporated into housing to promote accurate placement on the PCB. Are RoHS compliant and suitable for Pb-free reflow soldering processes. Packaging is tape and reel, per EIA-783 (56mm wide; 16mm pitch). Feature 30u" gold-plated contacts. Insulator housings are made of high-temperature glass-filled LCP, rated UL 94 V-0.  Meet EIA-700 AAAB specifications for IEEE 1386 applications. This standard can be found on VME, VME64 and VME64X boards, CompactPCI boards, Multibus I and II boards, desktop and portable computers and servers; can also be used as modular connectors for front panel and backplane I/O cards.

Mill-Max, www.mill-max.com/PR623

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
Don't have an account yet? Register Now!

Sign in to your account