A printing investigation revealed unexpectedly stable and adequate paste transfer levels for metric 0201 components.
This study finds a process similar to 0201 parts, with a 100 µm thick stencil and a nitrogen environment.
A methodology to calculate solder joint height is used to conduct a tolerance analysis on BGAs.
Silicon Valley’s choice for one-stop shoppers is gaining a national reputation for handling the toughest boards.
Press Releases
- SMTXTRA Partners with Quantum Systems to Expand Representation in Key Territories
- KYZEN Announces Exclusive Partnership with Manufacturers’ Representative Restronics Florida
- Koh Young will Showcase its Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225 on 11-13 June 2024 in Nuremberg, Germany
- Precision Automation & Assembly Appointed as New England Rep for Kubler US