A new way to assess up to 25 solder paste properties on an assembly line in five hours or less.
The feasibility of high-volume microminiature component manufacturing using Type 5 and 6 pastes.
Once a bitter foe of the West, the Southeast Asian nation has become a haven for electronics manufacturing.
Scanning multiple depths at once saves time and gives more accurate data at each depth.
A JEDEC tray filled with components of a single type is moved onto the stage of an automated acoustic microimaging system. The transducer begins scanning the tray, pulsing ultrasound into the components thousands of times a second and receiving the return echoes. Analysis of the echoes will identify components having internal anomalies that disqualify them from use. At the end of the line, those components will be removed.
Press Releases
- Phononic Launches Wholly Owned Subsidiary in Thailand as APAC Headquarters
- AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
- Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
- ZESTRON Welcomes Whitlock Associates as New Addition to their Existing Rep Team in Florida