Extreme Long-Term Printed Circuit Board Surface Finish Solderability Assessment
Could the surface finishes of a group of test specimens, found some 20 years after their fabrication, hold up to today’s testing measures? And what impact does finish thickness have on future solderability?
by Gerard O’Brien and Dave Hillman
iNEMI Roadmap Gets Industry Aligned
Industry leaders are fast at work on the iNEMI 2017 Roadmap, the biennial tome that serves as an answer to the ongoing question of what’s next for manufacturing technology. And while other industry efforts to chart the future are losing steam, iNEMI’s are still going strong.
by Mike Buetow
Using Cross-Sectioning for PCB Assembly Qualification
Cross-sectioning, while destructive, can be beneficial to printed circuit board assembly qualification as a means to understand process capability and identify potential design and manufacturing concerns. But you have to know where to cut.
by Scott Mazur
Working with the next generation.