Advanced Packaging Has Given a Significant Boost to the Memory Packaging Industry, Driving Growth and Innovation
LYON, FRANCE – Overall memory packaging revenue is estimated to have been US$15.1 billion in 2022, excluding testing. This corresponds to around 10% of overall stand-alone memory revenue, around US$144 billion in 2022. Yole Intelligence, part of Yole Group, forecasts that revenue will reach US$31.8 billion in 2028 with a CAGR22-28 of 13%.
According to Thibault Grossi, Senior Technology and Market Analyst, Semiconductor & Software Division at Yole Intelligence: “In terms of packaging revenue, DRAM will grow with a CAGR22-28 around 13% while NAND will grow faster, with a CAGR22-28 of 17%. Other memory technologies, such as NOR Flash, EEPROM, SRAM, and emerging NVM, are forecasted to grow with a CAGR22-28 of around 3%.”
AP has become a key enabler of technological progress for NAND and DRAM. Among the different AP approaches, hybrid bonding has emerged as the most promising solution to manufacture higher bit density and higher-performance memory devices.
Whether its use is intended to enable higher performance or smaller form factors, advanced packaging is an increasingly important factor in the memory value equation. From representing about 47% of memory packaging revenue in 2022, AP will represent 77% by 2028.
In this context, Yole Intelligence releases its new product: Memory Packaging 2023 report. In this study, the company – part of Yole Group – presents an overview of the semiconductor memory market, provides an understanding of memory packaging technologies and markets, and offers market forecasts for memory packaging. This report also describes the memory packaging business and delineates and analyzes the competitive landscape.
Wire-bond is the dominant packaging approach. It is widely used for mobile memory and storage applications, followed by flip-chip packaging, which continues expanding in the DRAM market.
The adoption of flip-chip packaging with short interconnects is essential to enable high bandwidths per pin. While wire-bond packaging may still meet DDR 5 performance requirements, analysts expect flip-chip packaging to become a must-have for DDR6.
Leadframe remains widely used for NOR Flash and other memory technologies and is the package with the highest volume of unit shipments.
WLCSP is being increasingly adopted for consumer/wearable applications requiring small form factors, such as True Wireless Stereo earbuds. It is found in low-density memory devices such as NOR Flash, EEPROM, and SLC NAND.
