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NAMPA, ID – Silicon Mountain, a leading electronic manufacturing company, has upgraded its selective soldering department with four new selective solder systems from Pillarhouse International. The company continues to invest to maintain the flexibility, quality, and turnaround necessary to meet each customer’s unique needs.

Silicon Mountain’s selective solder through-hole systems position its clients for success. The company reduces the risks of thermal shock and excessive flux contamination inherent to traditional systems. Silicon Mountain’s through- hole systems handle fragile displays easily. They allow components to be placed onto PCBs, panels, or other assemblies without disturbing nearby surface-mount technology (SMT) components. Silicon Mountain offers clients the speed and flexibility of its systems to help achieve repeatable success in their competitive markets.

“With this investment, we are enhancing our selective soldering capabilities and reinforcing our commitment to delivering the highest-quality electronic components to our customers,” Clint Roehr, Project Manager at Silicon Mountain. “This acquisition is a significant step forward for Silicon Mountain, and we are excited about the opportunities it will bring.”

The Pillarhouse International Orissa Synchrodex is a modular selective soldering system designed to eliminate the need for hand soldering. The first module in the line is equipped with a precision drop jet fluxer and upper and lower preheat modules. The next two modules have bottom side preheat, a drop jet fluxer, and solder pot/pump/nozzle setups.

The preheat helps with flux activation and raises the board temperature for better solder flow and reduced dwell time on the solder joints. All machines incorporate fiducial correction for increased accuracy. Having two soldering modules allows the soldering program to be split for increased flexibility and efficiency.

Silicon Mountain provides a wide range of services, whether it is prototyping for startups or high-volume manufacturing. Regardless of the service, the company aims for high quality and quick turnaround.

For more information about Silicon Mountain, visit https://siliconmtn.net/

SHINGLE SPRINGS, CA – PDR, founded in 1985, and today a leading manufacturer of BGA rework systems and X-ray systems, is pleased to announce a new partnership with Process Automation & Tool, llc (PAT) as its manufacturers’ representative in the southeastern United States.

With over 20 years of experience in the electronics industry, Process Automation is a trusted supplier of high-quality process automation and tooling solutions. As PDR’s new representative in Georgia, Tennessee, Alabama, and Mississippi, Process Automation will help expand the availability of PDR's advanced rework, test and inspection systems to customers throughout the region.

"We are excited to partner with Process Automation to increase our reach in the southeastern US," said Dave White, CEO of White Industrial Corporation, parent company of PDR Americas. "Process Automation's deep knowledge of the electronics industry, along with their commitment to customer service, makes them an ideal partner for PDR. Together, we will help more customers achieve greater productivity and quality in their electronic assembly processes."

Through this partnership, Process Automation will offer PDR's full range of products, including the award-winning IR Rework Systems X-ray Systems. "PDR's innovative solutions are a perfect fit for our customers' needs," said Andy Tressler, Partner of Process Automation. "We are proud to represent a company with such a strong reputation for excellence in the electronics industry. We look forward to working with PDR to provide top-of-the-line solutions and support to our customers."

PDR's partnership with Process Automation is an important step in expanding its distribution network in the southeastern US. With Process Automation's expertise and PDR's advanced technology solutions, customers throughout the region will have greater access to high-quality electronic assembly tools and services.

For more information about Process Automation & Tool, visit www.processauto.us 

TUCKER, GA – TAGARNO announced that its representative, Gardner & Meredith Inc., will exhibit at the SMTA Capital Expo & Tech Forum, scheduled to take place Tuesday, May 23, 2023 at Johns Hopkins University. Rick Richardson from Gardner & Meredith will showcase the TAGARNO ZAP Flexible Digital Microscope and TAGARNO TREND Digital USB + HDMI Microscope.

Install TAGARNO ZAP any way you want: On a flex arm, a focus tracker or in a third- party ø76 mm yoke. With TAGARNO ZAP, you choose the setup that matches your needs – and if they change, so can your setup. You can even activate more features by purchasing an Upgrade kit to make the most out of your investment.

TAGARNO TREND is a powerful tool for demanding professionals in need of a documentation microscope, precision microscope, or automation microscope. TAGARNO delivers intelligent and smart digital microscopes – also known as a computer microscope or digital camera microscope. The HD video microscope features built-in software, optical zoom, high frame rates and 1080p image quality.

With more than 250X, the TREND takes quality control to the next level. Customize the digital microscope with powerful and specialized software apps. Optimize processes for your specific tasks and use the camera to maximize efficiency, enhance quality of work, and make routines faster.

Meet with Rick Richardson at the SMTA Capital Expo to learn more. For more information about TAGARNO, visit www.tagarno.com 

TUCKER, GA – TAGARNO announced that its representative, Brook Anco Corporation, will exhibit at Design-2-Part Florida, scheduled to take place May 2-3, 2023 at the Orlando Convention Center. Brook Anco will showcase the TAGARNO FRONT and TAGARNO ZIP Digital USB Microscopes, along with the TAGARNO TREND Digital USB + HDMI Microscope in Booth #406.

TAGARNO FRONT is a smart and user-friendly digital microscope with an extensive range of intelligent and intuitive software applications. What sets it apart is its unique design. Regardless of your working depth or magnification level of choice, the microscope will create ultra sharp and sturdy images, allowing operators to perform accurate and high quality analyses with little interference from nearby movements.

TAGARNO TREND is a powerful tool for demanding professionals in need of a documentation microscope, precision microscope, or automation microscope. TAGARNO delivers intelligent and smart digital microscopes – also known as a computer microscope or digital camera microscope. The HD video microscope features built-in software, optical zoom, high frame rates and 1080p image quality.

With more than 250X, the TREND takes quality control to the next level. Customize the digital microscope with powerful and specialized software apps. Optimize processes for your specific tasks and use the camera to maximize efficiency, enhance quality of work, and make routines faster.

The TAGARNO ZIP is a great entry product for those new to the world of digital microscopy. The microscope is small and simple with more than 50X magnification and USB 3.0. Its user- friendly design makes it ideal for magnification tasks that do not require advanced features or software. With a reduced set of features, ZIP comes with lower buy-in costs without affecting the image quality.

Meet with the Brook Anco team at Design-2-Part Florida to learn more. For more information about TAGARNO, visit www.tagarno.com 

PRAGUE – Celestica Inc. (TSX: CL) (NYSE: CLS), a leader in design, manufacturing, and supply chain solutions for the world's most innovative companies, today announced a new design specification will be revealed at the Open Compute Project (OCP) Regional Summit in Prague, Czech Republic. This specification will be open and is expected to be approved as an official OCP contribution in May 2023. The design specification is compliant with the Enterprise Edge Gateway base specification contributed to OCP by Amazon Web Services (AWS). The Celestica Enterprise Edge Gateway product will pursue OCP Inspired™ recognition and will consist of the latest in enterprise edge gateway technology.

"Celestica continues to work with the OCP Community to enable the adoption of open networking at the enterprise edge," said Gavin Cato, Head and CTO, Hardware Platform Solutions, Celestica. "Our Enterprise Edge Gateway design submission to OCP is another example of this collaboration as Celestica leverages our world-class design capabilities to innovate, develop and support solutions for the enterprise."

The Enterprise Edge Gateway specification uses a Broadcom Trident-3 chipset with an 8-core Intel CPU module and is developed for both flexibility and performance in data center and enterprise-class edge deployments. Its 1U footprint delivers 48 multi-gig RJ45 ports (32 x 10/100/1000Mbps + 16 x 2.5GBase-T), 4 x 10G/25G SFP28 ports, along with unique features such as 20G service processing, 802.3bt (Type4) on all ports, MACSec, PTP and built-in Wi-Fi and LTE.

The Celstica Enterprise Edge Gateway is optimized for:

  • Retail and Manufacturing Edge Deployments
  • Video Surveillance
  • IoT and Smart Cities
  • Migration to SD-WAN/SASE

AWS supporting quote:

"AWS continues to execute on its strategy to create a vendor agnostic reliable supply chain for enterprise edge deployed equipment to support our internal services," said Michael Lane, Principal Technical Program Manager, AWS. "We are pleased to collaborate with innovative companies such as Celestica to empower a more open-sourced community."

OCP supporting quote:

"We welcome Celestica's continued participation in the OCP Community and recognize it as a driving force in building out the OCP's open edge computing strategy, by being part of a developing open multi-vendor supply chain for the enterprise. Celestica continues to make important contributions to the OCP and the open-source network community, to drive innovation and open networking," said George Tchaparian, CEO at the Open Compute Project Foundation. "We are excited to see Celestica's latest design specification of their Enterprise Edge Gateway as it is an important addition to the OCP open edge ecosystem carrying forward AWS's base specification contribution to design and then on to product."

Visit Celestica during the OCP Regional Summit in Prague in the main expo hall to meet its engineers and industry experts and see the company's latest advancements in open networking technologies.

BRUSSELS, BELGIUM – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the provisional agreement reached yesterday in the European Chips Act Trilogue Negotiations to invest €43 billion to bolster Europe’s microelectronics industry. The European Parliament, Commission and Council forged the agreement in Strasbourg, France.

In the year since the landmark legislation was drafted, the European Chips Act has become a strategic centerpiece of Europe’s industrial ambition. The legislation aims to facilitate the continent’s digital and green transition by strengthening its semiconductor industry production capacity. A strong supporter of Europe’s economic growth, SEMI Europe expects the EU Chips Act to help Europe increase its global semiconductor manufacturing share to 20% in the next decade.

The legislation includes a crisis response provision through which the European Commission will assess risks to the European Union’s semiconductor supply and publish early warning indicators in member states that might trigger EU-wide chip shortage alerts.

“The European Chips Act is a significant step forward for the semiconductor industry in Europe with robust investments to help strengthen manufacturing and the resiliency of global supply chains,” said Ajit Manocha, SEMI President and CEO. “In addition, the Act will enable cohesive strategies to grow Europe's talent base and ensure the region remains at the forefront of innovation.”

“Now is the time to invest in the semiconductor sector in Europe,” said Laith Altimime, President of SEMI Europe. “The European Chips Act strengthens the continent’s appeal as a destination for semiconductor industry investment and lays the groundwork for the growth of the entire ecosystem. The act will help create a more favorable environment for chip industry investments in Europe and promises to spark greater innovation.”

The European Chips Act is a cornerstone of efforts to strengthen Europe’s competitiveness in building chips and expand innovation in the design, manufacturing and packaging of chips. The act will also enable Europe to deepen its understanding of global semiconductor supply chains and address the skills shortage.

“SEMI looks forward to the implementation of the European Chips Act, which is crucial to strengthening Europe’s semiconductor competencies across the entire value chain,” said Christopher Frieling, Director of Advocacy and Public Policy at SEMI Europe.

Visit SEMI Global Advocacy to learn more about its public policy efforts and the latest developments. Go to SEMI Workforce Development for information on how SEMI is addressing the microelectronics industry’s talent needs.

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