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CLINTON, NY – Following a successful inaugural season which included six episodes and five high-profile guests from the EV industry, Indium Corporation’s EV InSIDER Live webcast series is set to launch its second season on April 13. EV InSIDER Live is co-hosted by Indium Corporation’s global head of e-Mobility and infrastructure, Brian O’Leary, and Loren McDonald, EV consultant and CEO of EVAdoption.

EV InSIDER Live is conducted in a candid and conversational format suitable for business executives, casual observers, and seasoned engineers alike. On each episode, O’Leary and McDonald are joined by a different high-profile guest from the EV industry. Season two will focus on three primary topic areas:

  • Reliability and customer experience: Recent studies have shown that EVs have more defects than internal combustion engine (ICE) vehicles and EV chargers are suffering from unacceptable levels of down time and poor user experience. Guests and hosts will delve into the root causes of poor EV and charging hardware reliability and explore what steps the industry needs to take to turn things around.
  • Supply chain/scaling production: From chips and battery minerals for EVs to backlogs for DC fast chargers and the transformers and switchgear needed to power them—supply chain issues continue to wreak havoc with the EV and charging industries. The challenges and approaches to scaling production and minimizing parts shortages, reducing timelines, and increasing quality will be explored.
  • Battery storage and new technologies: Experts will tackle the synergy of EVs with battery storage systems and the challenges of an endless influx of new electronics, technologies, and software updates into the EV ecosystem.

“The enthusiastic reception we received from season one of EV InSIDER Live demonstrated the timely need for a forum like this to examine not only the rapidly evolving EV industry, but the larger e-Mobility landscape,” said O’Leary. “Loren and I are looking forward to welcoming more EV game-changers as guests and investigating the hot button issues facing our industry together.”

Season two will kick off on April 13 at 11:30 a.m. EST with a session titled EV Fast Chargers: Can America Deploy Them Quick Enough? With dozens of new and increasingly compelling electric vehicle (EV) models with near or more than 300 miles of range coming to market, the biggest hurdle to mass adoption of EVs is a reliable and convenient charging infrastructure.

O’Leary and McDonald will be joined by John Thomas, COO of Autel, a fast-growing EV charging hardware company. He will share his views and expertise from being on the frontlines of this race to help America build out both Level 2 and DC fast-charging infrastructure. The conversation will focus on three core topic areas: the current state of the industry, the ability of charging infrastructure to meet demand, and the future of EV charging.

Click here to register for season two’s premier episode or, optionally, register for all upcoming season two episodes. All sessions will be made available for on-demand viewing afterward. EV InSIDER Live is driven by Indium Corporation.

MANASSAS, VA – ZESTRON, a leading global provider of high precision cleaning products, services, and training solutions for the electronics manufacturing industry, is pleased to announce that Senior Application Engineer, Ravi Parthasarathy, will be presenting his paper "Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs" at the SMTA High Reliability: Strategic Technology Advancement Research Forum on April 18, 2023, in Kansas City, MO, USA.

SMTA High Reliability: Strategic Technology Advancement Research Forum:

The SMTA High Reliability Forum is a highly anticipated annual event that provides a platform for leading industry experts to discuss and share their latest research findings and insights on emerging trends and challenges in the electronics manufacturing industry. This year's theme, "Advanced Packaging Technologies for High Reliability Applications," will focus on the latest advancements in packaging technologies for applications such as automotive, aerospace, and medical devices.

As a Senior Application Engineer at ZESTRON, Ravi Parthasarathy has extensive experience in the development and implementation of innovative cleaning processes for electronics manufacturing. His paper will highlight the challenges associated with defluxing ultra-fine pitch die on CoWs (Chip-on-Wire) and will provide insights into process considerations for achieving reliable and effective cleaning results.

MONTERREY, MEXICO – NIDEC MOEN (Motion & Energy) Division, based in St. Louis, MO, has installed a complete Yamaha line featuring the latest F4.0 Software, M2M, and Traceability and Monitoring tools in their recently opened factory in Monterrey, Mexico. The line was provided and installed by Yamaha Motor USA’s Industrial Robots and SMT Division.

Nick Cotton, Project Manager at NIDEC MOEN, said that “We’re extremely honored and proud to be part of this amazing project. This is the 4th Yamaha line we have installed in 3 countries across the world, giving NIDEC MOEN manufacturing the presence to support our customer base globally.”

With a pedigree dating back more than a century, NIDEC MOEN is a leading manufacturer of commercial motors, industrial motors, appliance motors, and controls. Their product line features a full line of U.S. MOTORS® brand high efficiency motors for industrial applications in water treatment, mining, oil and gas, and power generation, and for commercial applications such as condensers, cooling towers and large refrigeration units. NIDEC MOEN is recognized as a global leader in the design and manufacture of electric motors and integrated controls.

George Babka, Yamaha Sales General Manager, added, “Yamaha Industrial Robots and SMT Division is an innovator in the fields of surface mount manufacturing and robotics factory automation. We have enjoyed a long heritage of building upon our knowledge and advanced technologies since 1984. Our product lineup offers a wide range of industrial robots and automation products as well as full line surface mount solutions to meet or exceed our customers’ manufacturing needs.”

TUCKER, GA ― TAGARNO, a leading provider of digital microscopes, has developed a new ‘how to’ guide for implementing digital microscopes for soldering and PCB inspection. Magnification has been an integrated and crucial part of PCB production and rework for many years, and digital microscopes have taken PCB inspection to the next level.

What many electronics professionals find today is that traditional magnification systems can no longer provide the required magnification levels when doing quality control or when reworking faulty PCBs – nor are they equipped to capture photos and create documentation of your work in an efficient way. This sends PCB manufacturers hunting for new equipment that can do the job.

In this guide to digital microscopes within electronics, TAGARNO provides a detailed overview on:

  • What to consider when choosing a digital microscope for soldering and PCB inspection
  • The benefits of using a digital microscope for soldering and PCB inspection
  • Different Electronics processes where you can use a digital microscope
  • Choosing the best digital microscope for soldering and PCB inspection

TAGARNO’s line of microscopes offers a range of features and capabilities that make them ideal for a variety of applications. The company’s digital microscopes are designed to make it easier than ever to capture and share. For more information, visit www.targarno.com 

LYON, FRANCE – Fan-Out packaging revenue was US$1.86 billion in 2022. Yole Intelligence, part of Yole Group, expects it to have a CAGR of 12.5% through 2028, reaching US$3.8 billion. UHD FO will experience the fastest growth across all market classes, with a CAGR of 30%, growing from US$338 million in 2022 to US$1,630 million in 2028.

According to Gabriela Pereira, Technology and Market Analyst at Yole Intelligence: “HD FO is the dominating market class in 2022 with US$1,194 million in revenue, and it will have a 6.7% CAGR, reaching US$1,757 million in 2028. Core FO will have a 2.8% CAGR, increasing from US$329 million in 2022 to US$389 million in 2028. FO WLP volume will still dominate the market, with wafer production of 2,376K in 2028, versus 238K 300 mm wafer equivalent production for FO PLP . Total FO package volume will grow from 2,348 million units in 2022 to 2,960 in 2028. TSMC is the biggest FO packaging player, with 76.7% of the market”.

Indeed, as Yole Intelligence’s analysts affirm, the top three OSAT companies, ASE, Amkor, and JCET, together with TSMC, had more than 90% of the fan-out market in 2022.

In this context, Yole Intelligence releases its semiconductor packaging report, Fan-Out Packaging 2023. In this report, the company – part of Yole Group – identifies and describes which technologies can be classified as FO packaging and defines market classes. It also analyzes key market drivers, benefits, and challenges of FO packages for the different applications, the different existing technologies, their trends, and roadmaps and analyzes the supply chain and fan-out packaging market landscape. In addition, this report provides a market forecast for the coming years and estimates future trends.

FO packaging has evolved from a low-end packaging technology into a high-performance integration platform, with growing adoption in the HPC , networking, automotive, and high-end mobile markets. One of the major market trends driving fan-out packaging technology is large die partitioning into chiplets and heterogeneous integration. Fan-out is a cost-effective platform that enables high-bandwidth and high-density die-to-die interconnections through RDL -based processes. UHD FO will take market share from Si Interposers in the future through innovative FO-on-substrate and FO-embedded bridge solutions.

TSMC is the market leader in high-performance FO solutions for high-end computing, networking, and HPC applications. ASE, SPIL, Samsung, JCET, Amkor, PTI, TFME, and Nepes are developing similar solutions with huge potential to compete. Though core FO is the primary OSAT market, the main developments are in HD and UHD FO technologies.

FOPLP has been hyped as the solution for the widespread adoption of FO, especially for large package sizes. However, it still presents technical challenges, and there is a lack of demand to achieve the desired cost benefit.

Yole Intelligence’s semiconductor packaging team invites you to follow the technologies, related devices, applications, and markets on www.yolegroup.com.

SAN JOSE, CA – Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce the appointment of Adam Szychowski to Vice President, Sales & Marketing. An award-winning sales and marketing leader, Szychowski has more than 20 years of experience in starting up, turning around, and growing commercial sales teams in both private and public sectors.

In previous roles, Szychowski has rebuilt inside and outside sales teams by recruiting former employees in key management roles and changing policies and procedures to be more customer centric. He is a motivational and inspirational leader that develops high performance teams by empowering team members with clear expectations, sufficient tools, strategic game plans and a closed-loop feedback system.

Szychowski is hyper focused on creating a world- class customer experience and uses voice of the customer to change and adapt to new industry demands and customer requirements. Additionally, his extensive background in military and aerospace in the EMS space is a great fit as these are key target industries for Green Circuits.

As a leader in the industry, Green Circuits has more than 30 years of experience culminating in an extensive knowledge of printed circuit board fabrication and assembly. The company is built on a commitment to quality and a focus on speed and service. Green Circuits specializes in quick-turn prototypes, new product development, and early-stage production to speed customer product launch.

Green Circuits provides high-quality design, prototyping and full-scale production services for all types of printed circuit boards and complex systems. For more information, visit www.greencircuits.com 

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