INDIANAPOLIS, IN — Specialty Coating Systems (SCS) will exhibit in Booth #2301 at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The SCS team will showcase the Precisioncoat VI, PrecisionCure UVC (MUV) and conformal coating services.

With outstanding reliability and precision, the PrecisionCoat VI offers customers unmatched conformal coating and dispensing flexibility through a wide range of valves, tools and features.

SCS will have its industry-leading Automatic Quick Change (AQC) feature available for live demonstrations on the PrecisionCoat VI platform. The system will feature five programmable axes, servo motor position control and up to eight tools on a single machine to achieve exceptional accuracy, repeatability and high throughput for a wide range of automated material applications.

Additionally, SCS will exhibit its innovative curing system that features programmable curing profiles and the smallest footprint in the industry to maximize valuable production floor space. The PrecisionCure UVC microwave UV curing system provides customers with the flexibility needed to take their manufacturing operation to the next level.

The PrecisionCure UVC (MUV) utilizes Heraeus Noblelight ® microwave- activated UV lamps, the industry standard in microwave UV curing technology, and features a patent-pending lamp movement trolley that enables the UV lamp to move across the horizontal axis over a product on the conveyor. The curing system’s advanced lamp travel technology coupled with programmable curing profiles provides users with unparalleled control over the curing process.

With more than 50 years of experience in conformal coating engineering and applications, SCS is the world leader in Parylene, liquid, plasma polymerized, ALD and multilayer conformal coating technologies. The company is a direct descendant of the companies that originally developed Parylene, and leverages that expertise on every project – from initial planning to process application.

For more information, please visit www.scsequip.com

CLINTON, NY — Indium Corporation’s technical experts will share a variety of presentations on topics ranging from e-Mobility, achieving low voiding through solder preforms, high-performance metal thermal interface materials, low-temperature solder alloys, and low-temperature solder paste for wafer-level packaging at IPC APEX Expo, Jan. 24-26, San Diego, Calif., U.S.

Tuesday, Jan. 24

• Using Flux-Coated Preforms to Repeatably Achieve Low Voiding Under Power ICs: An Automotive Case Study by Regional Technical Manager and Technologist – Advanced Applications Andreas Karch

Wednesday, Jan. 25

• High-Performance Phase Change Metal TIMs by Product Development Specialist for Thermal Interface Materials Miloš Lazić

Thursday, Jan. 26

• e-Mobility/EV Automotive Technical Conference Special Session, co-chaired by Global Head of e-Mobility and Infrastructure Brian O’Leary.
• Energy Consumption Reduction Using Low-Temperature Solder Alloys by Senior Product Development Specialist Claire Hotvedt
• A Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application That Outperforms SAC305 by R&D Manager, Alloy Group Dr. HongWen Zhang

Karch provides technical support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials for customers in Germany, Austria, and Switzerland. Products include solder paste, solder preforms, fluxes, and thermal management materials. He has more than 20 years of automotive industry experience in PCB assembly and power electronics, including the advanced development of customized electronics. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Andreas is an ECQA-certified integrated design engineer and earned his Six Sigma Yellow Belt. His thorough understanding of process technologies and project management skills reinforces Indium Corporation’s commitment to providing world-class service to our customers in Europe.

Lazić is responsible for developing new thermal materials and products, and providing solutions for customer challenges and applications. He also develops new testing methods to evaluate power and thermal products, and gathers data on new and existing products for marketing presentations. He joined Indium Corporation in March 2018 as a Technical Support Engineer, primarily responsible for servicing the troubleshooting and application needs of customers in the Northwest, California, and Rocky Mountain regions. In 2018, he took on the role of Coordinator for the Live@ Program—a global initiative designed to align Indium Corporation and its industry partners in the promotion of agile response, resource management, and efficiency improvement. Prior to joining Indium Corporation, he worked as the Deputy Technical Director at Radio-Television Nis in Serbia. He earned his master’s degree in electronics engineering and his bachelor’s degree in electrical engineering from the University of Nis in Serbia. He is an Energy Efficiency Engineer certified by the Serbian Chamber of Engineers in Belgrade; a Certified SMT Process Engineer; and is fluent in English, Serbian, Croatian, and Bosnian. Lazić was awarded the Silver Quill Best Paper Award in 2020.

Hotvedt plays a highly visible and critical role in the future of Indium Corporation’s solder paste business. This role exists in a cross-functional team environment in which she facilitates team initiatives to execute the new product development process and deliver fully scaled, launched, marketable product solutions for PCB Assembly solder pastes. Additionally, Claire provides training to the Sales & Tech teams about new products and is responsible for introducing these products to industry-leading customers. Hotvedt joined Indium Corporation in May 2018 as a Research Technologist. In 2019, she took on the role of Product Development Specialist, where she has been integral in the development and commercialization of the Durafuse™ LT technology and other high-reliability alloy offerings, including Indalloy®276 and Indalloy®292. Prior to joining Indium Corporation, she was employed as a product development engineer at a Rochester-based photoresist developer and as a validation engineer at a Syracuse-based firm. She was first introduced to Indium Corporation as a summer intern in 2014, where she researched the extraction of indium from LCD screens. She earned a bachelor’s degree in chemical engineering from the University of Rochester, with a minor in Mandarin Chinese. In college, she was a member of the Phi Beta Kappa and Tau Beta Pi Engineering Honor Societies. She is a Certified SMT Process Engineer (CSMTPE).

O’Leary is responsible for promoting Indium Corporation’s full range of products and services for e-Mobility, which includes electric cars, trucks, eVTOLs, charging stations, etc. He joined Indium Corporation in 2014 and has more than 20 years of experience in the electronics industry. He authored two books on thermal profiling called Profiling Guide for Profitability and Profiling Guide for Six Sigma. He currently serves as the chair of the IPC e-Mobility Quality & Reliability Advisory Council. In addition to regular technical conference participation, he co-hosts a free monthly webcast—EV InSIDER Live—with Loren McDonald of EVAdoption and a high-profile industry stakeholder as a guest. In the webcast, they discuss current pressing issues and hot topics in the rapidly evolving electric vehicle landscape.

Zhang is manager of the Alloy Group in Indium Corporation’s Research & Development Department. His focus is on the development of lead-free solder materials and the associated technologies for high-temperature and high-reliability applications. He and Dr. Ning-Cheng Lee invented the mixed-alloy solder technique to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding interface, and control the joint’s morphology, thus improving reliability. On the basis of this technique, the BiAgX® solder system was invented as an alternative high-temperature lead-free solder. Dr. Zhang has a bachelor’s degree in metallurgical physical chemistry from Central South University of China, a master’s degree in materials science and engineering from the Institute of Metal Research, Chinese Academy of Science, a master’s degree in mechanical engineering, and a Ph.D. in material science and engineering from Michigan Technological University. He has extensive experience in various aluminum (Al) alloys and fiber/particle-reinforced Al-based composite materials, and Al-rich and ZrHf-based amorphous alloys. Dr. HongWen Zhang co-authored two book chapters on high-temperature lead-free bonding materials. He and his colleagues had seven patents granted globally and numbers of patents filed. He has published approximately 20 journal publications in the field of metallurgy, materials science and engineering, physics, electronics materials, and mechanics. He has also been invited as a peer reviewer for numerous journals. Dr. Zhang has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. He is also a certified IPC Specialist for IPC-A-600 and IPC-A-610D.

STOCKHOLM — As a leading global partner for flexible PCB assembly solutions, Mycronic will continue to respond to growing customer demand for standardized software integration and state-of-the-art inspection technologies at IPC APEX EXPO in San Diego, January 24-26, 2023. In addition to the latest factory connectivity, PCB assembly, jet printing, dispensing, coating and material handling solutions, the company will introduce major advances in 3D inspection technologies, auto-assisted programming and factory connectivity.

Boosting quality and productivity

As a turnkey solution provider for all process steps in PCB assembly, Mycronic will be welcoming visitors to discover a wide range of assembly process solutions at IPC APEX EXPO. Manufacturers will have a chance to discuss directly with Mycronic’s experts in inspection, printing, placement, material handling, dispensing and coating, and factory connectivity.

In today’s intelligent manufacturing environment, significant productivity gains can be made through improvements in data management and human-machine interaction. APEX visitors will have the opportunity to discuss the latest solutions to these information bottlenecks with Mycronic’s experts, whatever their production mix or class may be.

High-reliability manufacturers of aerospace, medical and automotive electronics will have a chance to discover a comprehensive range of process control, traceability and dispensing solutions. For those aiming to increase first pass yield with minimal programming and takt times, a number of next-generation inspection technologies will also be highlighted, including the new Iris™ 3D AOI vision technology and Escape Tracker programming assistant.

“We’ve already experienced huge interest in our latest breakthrough innovations in 3D inspection,” says Clemens Jargon, Sr VP High Flex. “The hardware, programming software and user interfaces have all been developed together with leading tier-one customers to make high-performance 3D inspection more accessible and future-proof for all types of manufacturing environments.”

A new generation of advanced AOI

The MYPro I series 3D AOI, released in 2022, is the company’s latest flagship in-line inspection system capable of continually improving product quality and first pass yield for all types of PCBs. On display at APEX will be the new Iris 3D AOI vision technology, which enables manufacturers to improve test coverage while capturing the industry’s highest-resolution images at speeds up to thirty percent faster than previous technologies. APEX visitors will have the opportunity to witness Iris in action at the Mycronic booth to see its breakthrough capabilities firsthand. The Iris 3D vision technology is available on all new MYPro I51/81/91 AOI systems as well as through upgrades to existing 2D and 3D AOI machines.

Escape Tracker, a real-time programming assistant that is part of the MYWizard programming software, will demonstrate entirely new levels of reliability and speed in inspection programming. A live demo will show how the software continuously scans and updates the system’s inspection library to eliminate escapes, substantially reducing false calls and consistently enhancing inspection models over time. Thanks to a unique combination of advanced machine vision and machine learning, the software enables efficient pattern and image recognition to simplify program fine-tuning regardless of production conditions or programmer skill levels.

Enhanced connectivity and process control

New for APEX is the MYPro Connect connectivity platform, which enables plug-and-play connectivity with all leading IPC-CFX-compatible MES and ERP systems. The platform’s standardized data exchange eliminates the need for custom integration and ensures stable connectivity to support the need for advanced traceability, changeover management and controlled assembly automation at the board level. With all MYPro process steps also Hermes compliant, Mycronic's connectivity solutions fully support EMS and OEMs in their Industry 4.0 strategies.

MYPro Link and MYCenter Analysis, which enable real-time performance monitoring and root cause analysis, will demonstrate the power of real-time KPIs to improve process performance. The MYPro Link software, which correlates data between solder paste inspection and automated optical inspection, helps to improve inspection efficiency and line performance, while MYCenter Analysis provides opportunities to monitor and improve placement process efficiency. Both products help operators efficiently troubleshoot and resolve production quality and utilization issues with detailed drill downs into relevant production images.

To further improve component storage and handling, the MYTower series X high-capacity intelligent storage solution will also be exhibited at APEX. These latest MYTower models provide up to twice the storage capacity compared with their predecessors of the same height, ensuring safe storage and material automation for a vast range of components, thereby preventing the assembly line’s efficiency from being impacted by component supply issues. The top-of-the-range MYTower 6X, for example, can store more than 2,468 4mm-thick component reels within a footprint less than 2 square meters.

Tailored solutions for automated electronics protection

To meet growing demand for high-precision electronics protection, Mycronic has continued on its path of rapid innovation and customer-driven development to firmly establish its MYSmart series of coating and dispensing solutions as a leading choice among global tier-one manufacturers. At IPC APEX EXPO visitors can experience versatile conformal coating and dispensing solutions and the latest valve technologies.

Producers of consumer electronics will welcome the high-speed jet dispensing valve technologies available for the MY700 Jet Dispenser, making it the industry’s fastest all-material jetting system. Wherever large-area, random-dot dispensing patterns are crucial to manufacturing quality and efficiency, the new jetting system brings the speed and accuracy of the MY700 into a far wider range of dispensing fluid applications.

“These are really exciting times for the industry,” says Kevin Clue, VP Global Sales High Flex. “I’m thrilled to welcome visitors to APEX, which is a golden opportunity to explore new ways to improve manufacturing flexibility, quality and productivity together.”

To experience live demos and to learn more about Mycronic’s MYPro Line, software and connectivity solutions, and MYSmart dispensing and coating platforms, visit booth #1339 at IPC APEX EXPO in San Diego, January 24-26, 2023.

GARDENA, CA ― Pemtron Technology, an inspection equipment developer and supplier, is pleased to announce that the company has added direct support in Canada. In addition to its local manufacturers’ representative, BROCK Electronics, the company has hired a specialized printed circuit board assembly (PCBA) technician with extensive hands-on experience based in Toronto, Canada.

Pemtron’s new Field Service Engineer has proven experience with SMT & PTH machine programming, setup and operation, preventive maintenance, troubleshooting and problem solving. In addition to providing maintenance and support, the new FSE will help Pemtron customers improve production efficiency and production quality. He earned his degree in Electronics Engineering.

Pemtron aims to become the unrivaled global No. 1 company in the field of inspection equipment based on state-of-the-art equipment equipped with the best hardware and software. Offering local support for its customers worldwide is a key step in the company’s strategy.

“Due to travel restrictions at the beginning of COVID-19, it was difficult to get to our customers in Canada,” said Steven T. Wongsonvanee, General Manager - Americas. “This is why it is so important to have feet on the ground and the ability to offer our customers in Canada fast support.”

Pemtron manufactures and sells 3D precision process inspection equipment in the SMT, semiconductor and secondary battery fields. Its equipment is based on inspection technology using 3D measurement and AI deep learning based on machine vision and image processing S/W technology using industrial high-speed camera images.

BROCK Electronics represents Pemtron throughout Canada. Founded in 1967, BROCK Electronics is a manufacturers’ representative providing equipment and supplies to the electronics assembly industry in Canada. For more information, visit www.brockelectronics.com.