AUBURN HILLS, MI — The Murray Percival Company, the award-winning leading supplier to the Midwest's electronics industry, is pleased to announce their sales force will be in attendance at the IPC APEX EXPO 2023 and representing SCHUNK at the show. SCHUNK is widely regarded as the leading provider of depaneling solutions, clamping technology, and gripping systems.

SCHUNK depaneling machines, both inline and batch, are well known and highly thought of in the industry. With the World’s most precise stand-alone depaneling machines, SCHUNK systems meet the most demanding requirements in today’s PCB industry. SCHUNK is the world’s only manufacturer to offer depaneling machines and flexible workpiece holder solutions from one source.

“As a courtesy, our sales team likes to arrange appointments for customers at key exhibits on the show floor,” said MARCOM Manager Mark Percival Jr. “One of the sales people from our experienced team will ensure that you speak to the right people and see the newest technologies to get the most out of your show experience, so please feel free to reach out to us to set up an appointment at APEX this year.”

Recently The Murray Percival Company was awarded Distributor of the Year by the Global Technology Awards for the second year in a row by Global SMT & Packaging at SMTA International in Minnesota, MN. At the IPC APEX Expo, The Murray Percival Company will represent about 30 of the most prestigious companies in the electronics industry, including MIRTEC, SCHUNK, MacDermid Alpha, Kurtz Ersa, KYZEN, ITW EAE, Hanwha, Cluso, JBC, IDENTCO, Apollo Seiko, EVS International and many more!

CLINTON, NY — Indium Corporation®, through coordination with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Jan. 24‒26 in San Diego, Calif., U.S.

Live@APEX is a collaboration between Indium Corporation and its industry partners. The program benefits all participants, including Indium Corporation, partners, and, most importantly, the customers, who get to experience the equipment and materials in a live-action environment.

This year’s program will highlight Indium Corporation materials, including:

• CW-807 – electronics soldering cored wire
• CW-818 – no-clean, high-reliability flux-cored wire
• FP-500 – no-clean flux pen
• Indium8.9HF – no-clean solder paste formulated for the higher processing temperatures of the electronics industry
• Indium9.88HF – no-clean solder paste for use in package-on-package (PoP) applications
• Indium12.8HF – jetting and microdispensing solder paste
• PicoShot® – jetting paste series with exceptional jetting performance
• Sn995 – low-maintenance, low-cost, Pb-free soldering alloy
• TACFlux® 007 – leading die-attach flux for the light-emitting diode (LED) industry

You can see these products at the following partner booths:

• AIR-VAC Engineering (booth #3033)
• Apollo Seiko (booth #2345)
• Essemtec (booth #3001)
• Finetech (booth #1534)
• Hakko USA (booth #2306)
• ITW EAE (booth #1106)
• JBC Tools (booth #1741)
• Juki Automation Systems (booth #2700)
• Koh Young Technology (booth #1116)
• KYZEN (booth #1545)
• MicroCare (booth #2901)
• Mycronic (booth #1339)
• Nano Dimension - Essemtec (booth #3001)
• PARMI USA (booth #2147)
• Pillarhouse USA (booth #923)
• PVA (booth #3133)
• Smart Sonic (booth #1227)
• Trans-Tec America (booth #3109)
• Universal Instruments Corporation (booth #1749)
• VERMES Microdispensing - NSW Automation (booth #1605)
• Yamaha Motor Corporation (booth #2722)
• ZESTRON Corporation (booth #1941)

By demonstrating Indium Corporation products on live equipment at the IPC APEX Expo, attendees get an accurate and honest depiction of the material’s performance. If you see an Indium Corporation product running in a booth, be sure to Tweet and tag @IndiumCorp or use the hashtag #LiveatAPEX.

To learn more about the Live@APEX program, contact Product Development Specialist Miloš Lazić.

VISTA, CA — Machine Vision Products, Inc will be exhibiting on booth 924 at the IPC Apex Expo in the San Diego Convention Center between January 24-26.

MVP will be demonstrating its latest ground-breaking software release containing major new inspection capabilities for inspection and metrology across a broad range of MicroElectronic, Semiconductor, and SMT applications. For Microelectronics inspection, MVP will be demonstrating both Hybrid/MCM Style Wirebond and RF product inspections. A preview of our latest AI/Deep Learning integration will also feature. We look forward to discussing your inspection requirements at our booth at the forthcoming IPC Apex show.

MVP continues to be a leader of AOI innovation, applicable to the most complex inspection challenges. With inspection platforms for Microelectronics, Semiconductor, and SMT, MVP continue to be versatile and adaptable for multiple inspection challenges and material handling formats.

In anticipation of the show Dr. George T. Ayoub, President of MVP said "The newly released 8.1 software elevates the AOI inspection experience to new levels. In effect, with 8.1 software release, MVP has added major inspection capabilities to its extensive toolbox. Among other notable innovations in this release, MVP has revamped all of its algorithms, enhancing them with new power and fusing them all into one common framework with a unified interactive user interface that is completely graphical (GTilt). As a result, the benefits to the user are ease of tuning, ease of learning and improved performance across the board for all applications. In addition, the program generation has been enhanced and streamlined to quickly and easily generate recipes programs in a step-by-step guided approach.

MVP is also demonstrating a preliminary version of its 8.3 software highlighting a brand-new, friendly user interface for the operator and programmer. 8.3 software will also showcase Artificial Intelligence (Deep Learning) module that integrates seamlessly with Cognex's VisionPro Deep Learning software suite providing exceptional capabilities in AI when needed.

With these landmark releases of software, MVP strengthens its leadership position in the AOI market in general and in the wire bond market, metrology, and surface inspection markets in particular. We feel confident that the software additions will be well received by all customers."

For more information about the new capabilities, and to learn more about the applications on the systems beyond what is described here, please contact MVP directly for more info by enquiring on its website www.visionpro.com/info or talking to any of its representatives in the show.

WATERBURY, CT — As one of the world’s largest hi-tech supply chains for the electronics industry, MacDermid Alpha, will showcase its extensive portfolio of integrated circuit, assembly, and semiconductor technologies at IPC APEX EXPO, January 24 – 26, in San Diego, CA. Reaching every aspect of the electronics supply chain from design to post-production, and beyond, MacDermid Alpha will highlight how they support manufacturers across the entire spectrum with solutions that transform ideas into next- generation technologies. Visitors are welcome to discover the latest assembly, circuitry, and semiconductor technologies at booth 1933 and see how they increase efficiency and reliability.

MacDermid Alpha’s technology supply chain is fully optimized with over 3,000 employees worldwide, servicing customers in over 50 countries with local and regional services, a rapid delivery time, lower manufacturing costs, and a seamless ‘start to finish’ experience. Combining strength in critical markets such as 5G, automotive and EV, military, aerospace, medical devices, and consumer goods, with world-class technologies and unrivaled, 24/7 technical support, MacDermid Alpha’s family of brands includes Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone.

Julia Murray, Senior Vice President of Marketing at MacDermid Alpha, comments, “We are in a unique position to offer the electronics community a complete ‘start to finish’ technology roadmap with some of the most advanced circuitry, assembly, and semiconductor technologies on the market. We are helping our customers redefine what’s possible and leverage capabilities to the next level. This is something we’re very excited about and we will be showcasing solutions from our 3 cornerstone divisions during the show.”

MacDermid Alpha will also present 4 separate technical papers on lightweight materials, solder alloy performance in automotives following vibration tests, surface finish performance for next- generation technology and assess the performance of assemblies coated with state-of-the-art materials as opposed to standard conformal coatings used by manufacturers. Each technical paper will provide audiences with groundbreaking findings that unlock, explore and unveil new test data.

Visit the MacDermid Alpha team at booth 1933 to find out how to power up complete electronics interconnection solutions. For further information, please visit www.macdermidalpha.com