2006 Issues

FEATURES

  • Cover Story
    Cleaning Up after Pb-Free
    Lacking field data for no-clean Pb-free solders and confidence in accelerated aging tests? An expected increase in contaminants means effective cleaning is the only way to guarantee an assembly won't fail due to residues.
    Leigh Jansen

  • Process Management
    Concurrent Manufacturing in an EMS Environment
    The changes and precautions to take down the line during implementation of Pb-free manufacturing. This review covers printing, placement, soldering, inspection, materials management, compatibility and marking.
    Amey Teredesai and Tony Batalha

  • Soldering Materials
    Pb-Free Solder Assembly for Mixed-Technology Boards
    While assemblers push for a single alloy throughout all soldering processes to avoid cross-contamination, tests show no joint degradation related to the mixing of SN100C and SAC alloys.
    Karl Seelig

  • Wire Bonding
    Increasing Process Reliability in Fine-Pitch Wire Bonding
    A two-year study involving millions of bonds on LQFPs and BGAs identifies close ties between the performance of the wire bonder capillary and subsequent failures.
    Yair Alcobi

FIRST PERSON

  • Caveat Lector
    A platform for all electronics.
    Mike Buetow

  • Talking Heads
    RVSI's Kevin Maddy.
    Mike Buetow

MONEY MATTERS

  • Focus on Business
    Data mining in EMS.
    Susan Mucha

  • Global Sourcing
    Qualification methods for CSPs.
    Robin Norvell

TECH TALK

  • On the Forefront
    R&D's new model.
    E. Jan Vardaman

  • Screen Printing
    Using DPMO to rate equipment performance.
    Clive Ashmore

  • Better Manufacturing
    HALT and HASS testing.
    Peter Grundy

  • Soldering Tips
    The new GEIA Pb-free guide.
    American Competitiveness Institute

  • Wave Soldering
    Guarding your pot.
    Gerjan Diepstraten

  • Test and Inspection
    Pin-in-hole reflow inspection.
    Dr. David Bernard and Bob Willis

  • Countdown to Pb-Free
    Recommendations for thermally challenging products.
    Joe Smetana and Thilo Sack

  • ESD Basics
    Eliminating ESD in the air.
    David E. Swenson

  • Process Doctor
    Resolving sulfate contamination.
    Terry Munson

  • Equipment Advances
    ECT's new board tester.

  • Technical Abstracts

DEPARTMENTS

Industry News
Market Watch
Assembly Insider
Nepcon China and SMT/Hybrid/Packaging Product Preview
Ad Index
Classifieds

On the cover: Due to a lack of Pb-free aging data, cleaning may make a comeback. (Cover photo courtesy Humiseal/Chase Specialty Coatings.)

FEATURES

  • Materials Declaration
    Full Disclosure
    What are your parts made out of? It's not so easy to know.
    Michael Kirschner

  • Pb-Free Printing Parameters
    Understanding Pb-Free Stencil Requirements
    This study of what happens when the process window is intentionally violated finds engineers should worry more about the effects of stencil geometries than a centered Pb-free print process.
    Clive Ashmore

  • Technology Innovations
    Integrating AOI and Selective Soldering
    A breakthrough machine for PTH mass soldering combines AOI and selective soldering in a single inline unit. How it works, and the business case behind it.
    Mark Cannon, Bob Klenke and Phil Zarrow

  • EMS RoHS Models
    Outsourcing RoHS-Compliant Production at a Distance
    How Beyonics tackled the Pb-free transition, and auditing advice for overseas customers.
    Eric Liew, Fadzol Zaman and Sivakumar Thanupillai

  • Supply Chain Solutions
    The Supply Excellence Project at Ericsson and Solectron
    Blending Lean and Agile concepts cut lead times by 75% on a complex, custom telecom product.
    Ylva Andersson, Jan Melin, Rolf Broström, Lindsay Ballantyne, Dave Cooper and Lennart Ivarsson

  • Procurement
    The Future of PCB Procurement
    The battle for supply-chain ownership pits distributors vs. EMS firms.
    Mike Buetow

  • Solder Joint Reliability
    Crack Growth Rate Measurement and Analysis for WLCSP SnAgCu Solder Joints
    Using FEM, cracking is correlated with average inelastic strain and strain energy density.
    Paresh Limaye, Bart Vandevelde, Dirk Vandepitte and Bert Verlinden

  • Pb-Free Wave Soldering
    Dynamics in Pb-Free Wave Soldering
    A five-phase study of fluxes and convection preheating related to three Pb-free alloys revealed a few unexpected twists.
    R.A. Szymanowski, D. Casati, E. Saglia, P. Lotosky, K. Howell and G. Hueste

FIRST PERSON

  • Caveat Lector
    Cookson gets reworked.
    Mike Buetow

  • Talking Heads
    Valor's Chuck Feingold and David Bengal.
    Mike Buetow

MONEY MATTERS

  • Focus on Business
    Sustaining profitability through services.
    Dr. Jonathon Linton

  • Global Sourcing
    How to kill business by not even trying.
    Greg Papandrew

TECH TALK

  • On the Forefront
    The "magic mix."
    Dr. Ken Gilleo

  • Screen Printing
    Z-axis support options.
    Joe Belmonte

  • Better Manufacturing
    When profiling is a good thing.
    Phil Zarrow

  • Soldering Tips
    A primer on x-ray fluorescence.
    American Competitiveness Institute

  • Wave Soldering
    Mitigating common Pb-free defects.
    Gerjan Diepstraten

  • Countdown to Pb-Free
    Don't bank on an RoHS extension.
    Steven Andrews

  • Process Doctor
    Are your cleaning processes in control?
    Terry Munson

  • Equipment Advances
    Juki's selective soldering series.

  • Technical Abstracts

DEPARTMENTS

Industry News
Market Watch
Assembly Insider
Ad Index
Product Spotlight

On the cover: The influence of aperture designs on Pb-free assembly. (Cover photo courtesy of DEK. Inset courtesy of ERSA.)

FEATURES

  • Flex Assembly
    Installing Flash LEDs on Flex
    Recommendations on soldering and bending processes when components are mounted on a flex circuit.
    Shereen Lim

  • Pb-Free Soldering Profiles
    Processes and Their Parameters
    Although many important aspects required to establish the “ultimate” profile for wave or reflow soldering have not yet been investigated, several can be used as a starting point.
    Markus Walter

  • Cover Story
    Use of Closed-Loop Process Controls in Dispensing
    Tests show that a two-component epoxy adhesive will change in viscosity over time and cause a direct change in the amount being deposited. Yet a simple weight measurement can be used to calibrate a dispensing process.
    James Klocke

  • Encapsulant Materials
    Low Pressure Molding: A Primer
    Low pressure molding reduces the process steps required by conventional potting techniques and is now in use for complete encapsulation of PCBs.
    Frank Ongkiehong and Steven Dufresne

  • Productronica Recap
    Still the King of Shows
    Three standout products made royal debuts at the world’s largest electronics equipment fair.
    Mike Buetow

  • Pb-Free Rework
    Hand Solder Rework of Pb-Free PTH and SMT Packages
    A study of over 1300 Pb-free components proves Pb-free hand solder rework can be performed reliably. The top variable: Operator experience.
    Alan Donaldson

FIRST PERSON

  • Caveat Lector
    A manager worth remembering.
    Mike Buetow

  • Talking Heads
    Motorola’s Aroon Tungare.
    Mike Buetow

MONEY MATTERS

  • Focus on Business
    Locating EMS operations.
    Susan Mucha

  • Global Sourcing
    Evaluating a Pb-free line.
    Guy Martindale and H.R. Chai

TECH TALK

  • On the Forefront
    From tragedy comes opportunity.
    E. Jan Vardaman

  • Screen Printing
    Chip attachment and encapsulation.
    Clive Ashmore

  • Soldering Tips
    Nondestructive BGA inspection.
    American Competitiveness Institute

  • Wave Soldering
    Warm up to ‘frosty’ joints.
    Gerjan Diepstraten

  • Test and Inspection
    Adjustments for Pb-free parts.
    Jens Kokott

  • Countdown to Pb-Free
    Tin whisker management, part 2.
    Joe Smetana and Ron Gedney

  • Process Doctor
    Debunking white residues.
    Terry Munson

  • Software Advances
    Mentor’s Expedition Enterprise.

  • Technical Abstracts

DEPARTMENTS

Industry News
Market Watch
Assembly Insider
Ad Index
Apex Product Preview
Classifieds

On the cover: Closed-loop dispensing made easy. (Photo of XyFlex Pro+ courtesy Speedline Technologies)

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