PEACHTREE CITY, GA –February 27, 2026 – PCB Detroit will be returning to Wayne State University in June, the Printed Circuit Engineering Association (PCEA) announced today. The conference will include a variety of technical sessions, as well as a tabletop exhibition.
The sessions take place on June 15-16, 2026 on the campus of Wayne State University in Detroit, MI, and cover topics including ESD design techniques, mechanical system design for EMI, the impact of thin copper on PCB designs, increasing design efficiency with AI, and designing for unique RF features, among others.
Conference sessions include:
PCB Detroit will also feature a tabletop exhibition on June 16 with fourteen companies including: A2Z Electronics LLC, ADCO Circuits, AllSpice.io, ASC Sunstone Circuits, BarTron Inc., Cofactr, DirectPCB, DownStream Technologies, Electronic Interconnect, K&F Electronics, Polyonics, RBB, Summit Interconnect, and Zuken USA.
A free reception on June 15 and a special designers meetup (registration required) on June 16 will be held after classes end on those days.
“PCB Detroit is the only place the electronics industry can see Rick Hartley, Susy Webb, Dan Beeker and Steph Chavez together at the same time in the Midwest,” said Mike Buetow, president of the Printed Circuit Engineering Association. “And the opportunities not just to learn but to network with fellow designers and engineers should not be missed.”
Registration for the two-day technical conference and the tabletop exhibition takes place at events.american-tradeshow.com/pcbdetroit/begin. Conference registration is required for both the conference and tabletop exhibition. Plus, lunch will be provided to registrants.
Wayne State University is Michigan’s third-largest university, and a licensee of the PCEA Training Certified Printed Circuit Designer curriculum.
For more information about PCB Detroit, visit pcea.net/pcb-detroit or contact pcbdetroit@pcea.net.