Gap Filler 3500LV is a two-part liquid material that reportedly delivers high thermal conductivity and low volatility for reduced outgassing. Cures at room temp. with the option of accelerated curing through the addition of heat. Delivers thermal conductivity of 3.5 W/m-K and mechanical property benefits of silicone. Low volatile content is controlled lot to lot. Is beneficial in applications that require optics remain free of lens fogging, such as automotive headlamps, stadium lighting and high-intensity LEDs.  Once cured, it is a soft material that provides protection from shock and vibration. Has ability to fill tiny gaps and voids and has zero shrinkage.

Henkel, www.henkelna.com

Siplace BulkFeeder X eliminates component reels. Permits tapeless supply of components in sizes 0402, 0201 and 01005 for high-speed applications. Sets up like any classic feeder on changeover table, but holds up to 1.5 million components at a time. Coordinates interplay of shutter and vibration mechanisms, vision system, and placement heads. Eliminates splicing. Uses a vibrating mechanism to pour loose components from a container onto a pickup plate made of glass. Built-in camera takes a picture of the components from underneath the glass plate. The placement machine analyzes the image and determines which components are located on the plate in a position that is suitable for pickup and which are not, for example because they are upside down or too close to each other.

ASM Assembly Systems, www.siplace.com 

Mycronic 4.0 automated, intelligent factory software for just-in-time production enables visibility planning, material tracking, efficient changeovers, automated replenishment and intelligent storage solutions.

Mycronic, www.mycronic.com

DEK Nano Ultra Stencil  is said to improve solder paste transfer by up to 40% in fine-pitch applications with area ratios of less than 0.6. Benefits include volume stability; clean edges for improved print quality; higher process stability; lower underscreen cleaning frequency (reduced underscreen cleaning fabric and cleaning solvent consumption). Coating thickness of 2 to 4µm.

ASM Assembly Systems/DEK, www.dek.com

Siplace TX series placement machines place components down to 03015/0201 metric in high volumes.

RSV series convection reflow soldering ovens include vacuum to reduce voids to fewer than 1%. Come in five or six heating zone versions, each with one vacuum zone and two cooling zones. Footprint is 5,070mm up to 6,229mm. Handle PCBs from 100 x 150mm up to 330 x 250mm. Large flux collection unit is said to reduce flux cleanings to a few times per year.

Eightech Tectron, www.eightech.com

Maxrel solder alloy comes in solder paste, preform and wire formats. Maintains shear strength after 1,000 thermal cycles under high CTE mismatch conditions. For LED chip-on-board (COB) assembly where high CTE mismatch can exist between the die stack and substrate, and creep fatigue properties of the solder material are important.

Alpha, alpha.alent.com/Markets/LED

Two Part Mix solder pastes come in two compartment bags that keep flux and solder powder separate from each other until mixed.  Have two-year shelf life without refrigeration.  Mix inside bag by squeezing flux toward powder, causing seal to release. Knead bag end-to-end for two to three minutes to fully mix the paste.

Chip Quik, www.chipquik.com

Jumbo Elephant surface cleaner removes electrically charged particles on electronic assemblies. Combines ionization, compressed air cleaning, extraction and filtration technologies. Ionization neutralizes surface charges. Integrated compressed air nozzle removes fine particles from wells or indentations. Particles are exhausted and filtered. Particle-free purified air can be fed back to the working area. Portable. Max. noise level is 49 dB.

Ult, www.ult.de

Vario AOI line has a new camera module. Compact housing includes one orthogonal and four angled-view cameras with 360° inspection, along with multispectral lighting. All cameras have large and congruent field of view and short image acquisition time. Telecentric optical system for orthogonal camera works in conjunction with adapted focal plane of angled-view modules for fault detection. Has axis system based on linear actuators. Optional 3D module features shadow-free measurement of components and solder joints, as well as circumference inspection, inspection for pins bent in x-y axis and measurement of pin height.

Goepel electronic, www.goepel.com

EVO Cam digital microscope has magnification up to 300x and auto focus. Is designed for precision inspection tasks, rework, and repair. Includes live video streaming, full-HD 1080p/60fps image quality, and an 8-point LED ring light. A 30:1 optical zoom provides ability to view whole samples or smallest details. Is reportedly ideal for inspecting printed circuit boards, wafers, connectors, and SMT products.

Vision Engineering, www.visioneng.us

YSi-V 5M comes with 5Mp cameras for 2D AOI. Is field upgradeable for high-speed 3D inspection and 4D capability, the latter by employing four additional off-axis cameras along with its main downward-looking camera.

Yamaha IM, yamaha-motor-im.com