Indium Corp. Launches SiPaste C312HF Solder Paste
Indium Corp. SiPaste C312HF halogen-free, cleanable solder paste is for fine-feature printing.
Designed with Type 7 powder for aperture sizes down to 60μm, it enables fine-feature printing in advanced system-in-package applications. Is said to offer class stencil print transfer efficiency and stencil life with consistent printing, response-to-pause, and reflow performance. Post-reflow flux residue can be cleaned with a standard cleaning process using semiaqueous chemistries or a saponifier, or it can be used as a standard no-clean paste in processes where post-reflow cleaning is not required. Offers slump resistance, Low voiding across all components, minimal stencil cleaning during printing, a waide reflow profile window, and wets to various metallization. Is specifically designed for fine-feature printing with fine powders ranging from Type 5 to Type 8.
Indium Corporation
