Shenmao PF606-P279L ultra-fine pitch solder paste is for mini-LED manufacturing.

Built with Type 6 and Type 7 solder powder, offers uniform particle shape and size for smooth, consistent printing through stencil apertures as small as 60 microns. Is said to deliver stable performance with no splashing, minimal voiding, and strong die stability. Cadapted for Type 8 and finer powders, for future-generation mini and micro-LED designs. Comes in SAC 305 and multiple Sn-based alloys, including Sn-Sb, Sn-Bi, and Sn-Bi-Ag.

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