2C51 two-part silicone conformal coating and potting material is fast curing and has high dielectric strength. Provides protection if used to encapsulate a printed circuit board. A one to one mix ratio ensures accurate blending of the two parts. Autocatalytic cure enables curing without applied heat; can be accelerated with mild temperature increase. Full cure can be achieved in 30 min. at 70°C or 60 min. at room temperature.

HumiSeal, www.humiseal.com