The XD7600NT
100 digital x-ray inspection system
has 0.1 µm feature recognition for finite analysis of inspection applications.
Is equipped with a 2M pixel camera; offers oblique angle viewing of up to 70°
in any position around any point of a 16 x 18" inspection area. Is
configured with dual monitors: combines a 24" widescreen LCD monitor with
the navigation map on a 20" flat panel LCD display. Is available with a
tube combining 10W of power and submicron feature recognition. Can be equipped with CT providing 3-D
modeling and volumetric measurement of solder joints. Is suited for analytical
analysis of solder interconnections for critical applications such as stacked
die, MEMS, package-in-package and package-on-package.
Dage, www.dage-group.com