Understanding PCB Design Variables that Contribute to Warpage during Module-Carrier Attachment
In an effort to improve attachment yield rates of a module to a carrier board, a design of experiment evaluated several PCB design variables believed to contribute to
warpage during reflow. The objective was to isolate key design parameters that contribute most to the attachment problems. Shadow moiré was used to provide accurate
warpage profiles of the six-up module arrays before and after top- and bottom-side assembly, and again before and after attachment to the carrier board.
by Donald Adams, Todd MacFadden, Rafael Maradiaga and Ryan Curry
Cost and Risk Reductions Using the IPC Traceability Standard
Many see traceability as a burden to the manufacturing process, and having to comply or conform to yet another process or standard is not considered a good day in the office or factory. IPC-1782 removes such headaches..
by Michael Ford
The Future of Through-Hole Technology
Will through-hole components become obsolete? The data say no.
by Jennifer Nguyen
Improving the PCB Assembly Manufacturing Process by an Alternative Solder Paste: A Statistical Evaluation, Part II
The results of a two-part series studying solder paste printing performance of a novel Pb-free solder paste compared to traditional solder materials under harsh environments
across a range of components as small as 01005.
by Dr. Denis Barbini
Why the industry is looking up.
Driven to distraction.