Pb-Free Manufacturability and Test Control
Lead-free solder is not a drop-in replacement electrically or mechanically. Determining the "sweet spot" between electrical contact and mechanical deformation.
Terence Q. Collier
Can Odd-Form Automation Increase Returns?
Still placing odd-form parts by hand? How to determine ROI of end-of-line automation.
Allen W. Duck and Patty Chonis
Assessing Solder Joint Reliability in Pb-Free Assemblies
A study finds distinctions between predictors of reliability for leaded and lead-free alloys.
Throughput vs. Cycle Time in Evaluating Paste Printing
Is the best indicator of performance machine cycle time, or first-pass yield?
Joe Belmonte and Bob Boyes
Enabling Quick Response Manufacturing
End manufacturing and supply-chain redundancies through software that enables flexible operations and fast changeovers.
Doug Johnson and Vern Harrison
Programming for Mixed-Vendor Lines
Creating part data libraries for placement machines is time-consuming, error-prone and labor intensive. New tools can automate the process.
Cracking the WIP.
On the Forefront
A hard look at solid solder deposit.
Siemens' Tilo Brandis.
A challenge to the new ODMs.
A renewed need for ESD control.
Diagnosing residue problems.
On the cover: Design and process factors are the focus of this month's cover story. (photo © David Freund)