Washington, MO – Aligned Solutions, a leading provider of materials and services to the circuit board assembly, semiconductor, and wire processing industries, is pleased to announce that Bryce Timms will assume the role of Regional Sales Representative for Ohio, Kentucky, and Western Pennsylvania. This transition follows Mike Young’s decision to focus his efforts as CEO of Sasinno Americas, a company specializing in advanced soldering solutions.

Bryce Timms brings a wealth of experience in the electronics manufacturing industry, having previously served as Managing Director at Essemtec USA. His expertise in SMT and commitment to customer success make him a valuable addition to the Aligned Solutions team.

Mike Young, who has been instrumental in expanding Aligned Solutions' presence in the Midwest, will now dedicate his leadership to Sasinno Americas. Under his guidance, Sasinno Americas aims to deliver innovative soldering solutions that meet the evolving needs of the electronics manufacturing sector.

“We are excited to welcome Bryce to our team,” said Jim Rittman, Aligned Solutions. “His industry knowledge and dedication to excellence align perfectly with our mission to provide top-tier solutions to our clients. We also extend our gratitude to Mike for his years of service and wish him continued success at Sasinno Americas.”

For more information about Aligned Solutions and its offerings, please visit www.alignedsolutionsinc.com.

About Aligned Solutions

Founded in 2003 and headquartered in Washington, Missouri, Aligned Solutions, Inc. is a trusted manufacturers' representative firm serving the Midwest's electronics manufacturing sector. The company provides equipment, materials, and services to industries including circuit board assembly, semiconductor, and wire processing. With a commitment to aligning technology, people, and innovation, Aligned Solutions supports clients across states such as Arkansas, Illinois, Indiana, Iowa, Kansas, Kentucky, Michigan, Minnesota, Missouri, Nebraska, North Dakota, Ohio, Oklahoma, Pennsylvania, South Dakota, West Virginia, and Wisconsin. Their expertise spans surface mount and through-hole technology, wire harness assembly, semiconductor prototyping, box build assembly, and high-tech lab support.