Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled “DIE PLACEMENT HEAD WITH TURRET” and numbered ZL 201680048482.5 (PCT/US2016/047135) on July 30th, 2021 by the China National Intellectual Property Administration (CNIPA). This patent covers an innovative design that utilizes a precision horizontal tool holding turret for rapid and in-process calibration-free tool changing. This design significantly improves throughput when multiple tools are needed in fabricating complex multi-die devices by practically eliminating time consuming tool changeovers.

This patent is among the first of many patents being applied for in China and around the globe. We expect more patents to be granted following this success. Our effort in rigorously seeking patent protection in China reflects our confidence in the Chinese market potential for our die bonder systems, as well as in the increasing effectiveness of intellectual property protection in China. Innovation is key to our ability to support our customers. Mycronic is committed to technological innovations and is determined to enforce protection of our intellectual property worldwide.