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2020 Magazine Archives
December 2020
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High-reliability low-temperature solder alloys
The CIRCUITS ASSEMBLY EMS Company of the Year
Why you should consider a certification program
Apertures for 01005 components
Process questions to ask before taking action
When through-hole connectors move
A look back at friends and colleagues who left us in 2020
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November 2020
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Solder mask and low-standoff component cleaning
Low-temperature solders under x-ray PCB delamination root causes
PCB delamination root causes
The cost-reduction conundrum
Will the US support R&D in manufacturing?
The time is now for a new US tech policy
Advanced packages in portable products
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October 2020
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Five ways to ensure seamless program transfer
Solder joint corrosion causes
Stencil life
Covid: The ultimate organizational stress test
Is your customer service costing you customers?
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September 2020
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Enabling technologies for medical electronics
The world's largest printed circuit board fabricators
Updates in silicon and electronics technology
The role of AR and VR in longer, better lives
Will the OSP spec finally be finished?
Leveraging the IT department to reduce operation-caused variation
X-ray images and the dangers of overmodification
High-temperature soldering of through-hole connectors
Who audits the auditors?
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August 2020
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BGA package inspection using x-ray and ultrasound
Leveraging systems and processes to evolve NPI
Recommendations for ensuring long-term access to key component packages
Rethinking and repurposing marketing dollars
Navigating the flex circuit roadmap
Remote access to process equipment
Lifted parts, their causes and remedies
Low-temperature solders
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July 2020
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MES-based process control of test machines using IPC-CFX
A factory layout plan to match staff resources to immediate demand
IoT standards
Why board orders go on hold, and how to prevent it
Benchmark Electronics opens a fab shop
Lean and Covid-19 supply-chain challenges
Bare board purchasing plans
Component body lifting
Held captive by Covid
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June 2020
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Materials considerations for automotive radar designs
Packaging technologies for high-end computing systems
Viral marketing
What to do when your PCB supplier is acquired
Screen printing support systems
PCB warpage
Uneven layer counts on flex circuits
Pin-in-paste defects
How much radiation can electronic components handle?
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May 2020
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The CIRCUITS ASSEMBLY Top 50 largest EMS companies
Qualified manufacturing process development by applying IPC J-STD-001G cleanliness standard
An hour-by-hour look at the quickturn fabrication process
Component wettability tests
The factory pf the future, and what flexibility really buys us
Factory automation and Lean Six Sigma
Your PCB supplier was acquired. What now?
A Covid crisis? Or just poor management?
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April 2020
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BGA pitch impacts on bare board fabrication
Future aerospace and defense product requirements
Cleaning and drying before conformal coating
Crisis communications strategies
Nepcon Japan recap
Cleaning small PCBs
PCB manufacturing equipment advances
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February 2020
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Low-temperature tin-bismuth (SnBi)-based solder reliability performance
Automated tin whisker risk assessment
Augmented reality (AR) solutions for the factory
What is the role of heterogeneous integration in the AI hardware ecosystem?
Are robots good for human workers?
Low-cost ways to expand your fabrication base
Screen printing alignment issues
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March 2020
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Stencil tension effects on PCB assembly
Planning for supply chain disasters
Artificial intelligence in x-ray inspection
Dye and pry testing on BGAs
3-D printing solutions
IPC Apex Expo recap
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January 2020
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Automating detection of pick-and-place nozzle anomalies
Rocket EMS: The 2019 CIRCUITS ASSEMBLY EMS Company of the Year
Solder paste migration
X-ray inspection vs. microsectioning
An interview with Keith (Koichiro) Nishikawa
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Press Releases
TTM Technologies, Inc. Earns IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements Qualified Manufacturers Listing (QML)
KYZEN Strengthens Florida Presence with Kurt Whitlock Associates
bintel AB prepares for its increasing order intake and scale up of sensors within waste management by signing an agreement with the global manufacturer Scanfil
SMS Electronics Puts it Facility into Focus
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