2018 Magazine Archives

FEATURES

SOLDER VOIDING
Fill the Void III
In the third of a series of studies, several new variables were tested and compared to previous data on voiding. This round used a new board design that includes two sizes of QFNs, BGAs and LGAs susceptible to voiding, and tested multiple powder sizes.
by Tony Lentz

INEMI ROADMAP
The Ongoing Convergence of Gaming Devices
Cost, power, bandwidth and form factor of these mobile devices continue to be driving factors for acceleration of integration of silicon and system capabilities into single package or single die.
by Kartik Ananth

TEARDOWNS
Microsoft Xbox One X Teardown
A custom chip built on the AMD platform powers the popular video game console.
by Mike Buetow

FIRST PERSON

• CAVEAT LECTOR
  Over inspection?
  Mike Buetow

MONEY MATTERS

• ROI
  Treasure hunt.
  Peter Bigelow
  

TECH TALK

• ON THE FOREFRONT
  Nepcon Japan: The marriage of ASICs and memory.
  Jan Vardaman
• TECH TIPS
  The right to profile.
  Timothy O’Neill
• DEFECTS DATABASE
  The finish effect on wicking.
  Martin Wickham
• TEST AND INSPECTION
  BGA void analysis.
  David Bernard, Ph.D.
• TEST AND INSPECTION
  Call of duty.
  Robert Boguski
• GETTING LEAN
  Taking test offline.
  Hom-Ming Chang
• View the Digital Edition