2010 Magazine Archives

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FEATURES

Documentation
Automating the Documentation Process
“Documentation is much bigger than just design, fab and assembly,” experts say. A look at best-in-class processes that reduce the amount of time spent on drawings and notes by creating a “living” document.
by Mike Buetow

DfM
Best Practices for Double-Sided Mixed-Technology Boards
Plated through-hole assembly remains in use for some heavy power connectors, transformers and other devices where strong mechanical bonds are required. Reason: Heavy parts are prone to falling off during soldering.
by George Henning

COVER STORY
A Critique of IPC-A-610E
The industry standard for visual acceptance criteria for post-assembly soldering and mechanical assembly requirements has been revised. A master trainer assesses the revised guidelines, looking at the many changes to package-on-package and leadless device packages, flex circuits, board-in-board connections and newer style SMT terminations.
by Bob Wettermann

Solder Materials
Present and Future Solder Technologies
Next-gen product relies on advanced powder technologies, better flux formulations, and dual-function materials such as epoxy fluxes. How powders, activator chemistries and fluxes are evolving for production use.
by Neil Poole, Ph.D., and Brian Toleno, Ph.D.

SMT Cleaning
Post-Reflow Residue Results Following pH-Neutral Cleaner Application
A study of 40 leaded and Pb-free solders compares alkaline to pH-neutral cleaning agents.
by Harald Wack, Ph.D., Joachim Becht, Ph.D., Michael McCutchen and Umut Tosun

FIRST PERSON

• Caveat Lector
  Overreach?
  Mike Buetow

MONEY MATTERS

• Sherman’s Market
  Foxconn’s suicide cluster, in context.
  Randall Sherman

• Global Sourcing
  Low cost: the death of innovation.
  Richard Platt

• ROI
  Standard mistakes.
  Peter Bigelow

TECH TALK

• On the Forefront
  LEDs’ bright future.
  E. Jan Vardaman

• Selective Soldering
  A primer on nozzle types.
  Alan Cable

• Tech Tips
  Ball attachment with preforms.
  ACI Technologies Inc.

• Test and Inspection
  Eight steps to great ICT coverage.
  Jun Balangue

• SMT Troubleshooting
  Reflow-related bridging.
  Paul Lotosky

• Defects Database
  Finer powders, more solder balling?
  Dr. Davide Di Maio
  

• Process Doctor
  Cleaning’s building blocks.
  Dr. Harald Wack

• Solar Technologies
  The solar show circuit.
  Andy Ure

• Materials World
  Soured by graping?
  Jie Bai

• Technical Abstracts
  In Case You Missed It.
  Mike Buetow