2009 Magazine Archives

• View the Digital Edition
  

FEATURES

• Cover Story
  Research on Ionic Cleanliness Testing Alternatives to IPA/Water
  A study of alternative solvent mixes was undertaken to establish whether IPA-water mix could be improved. Following a down-selection of potentially suitable solvents, the mixes were applied to commonly available flux residues. The revelation: IPA water is limited as a cleaner and should not be a standard for analytical extraction tests.
  by Harald Wack, Ph.D., Syed Ahmad and Joachim Becht, Ph.D.
  

• iNEMI Roadmap
  Information Management Gaps for Board Fabrication and Assembly
  Within board fabrication and assembly, improvements in information management are needed in several areas. The link between design and manufacturing, part traceability, and PWB systems all have new needs that can be addressed by improved systems.
  by Eric Simmon
  

• Leda Corp.
  Aerospace Design and Assembly in Surf City USA
  When Boeing needs prototype assemblies, it jets on down to Leda Corp. With a new building and equipment set, Leda is preparing to take off.
  by Chelsey Drysdale
  

• Chip Packaging
  3-D IC Bonding
  Supply-chain roles are changing, with EMS firms expected to take a bigger chip-packaging role. New 3-D ICs provide an opportunity to expand services. Here's a look at how these packages are bonded, including the advantages and limitations of each technology.
  by Chris Sanders
  

FIRST PERSON

• Caveat Lector
  In search of focus.
  Mike Buetow
• Talking Heads
  Siemens' Guenter Lauber.
  Mike Buetow

MONEY MATTERS

• Global Sourcing
  The supply chain works best when diligence and consistency rule the relationships.
  Charlie Barnhart
• Focus on Business
  Ramping EMS sales efforts.
  Susan Mucha

TECH TALK

• On the Forefront
  Chewing on wafer-level packages.
  E. Jan Vardaman
• Screen Printing
  Mixed-size component printing, part 2.
  Dr. Rita Mohanty
• Selective Soldering
  Controlling the solder angle.
  Dr. Denis Barbini
• Wave Soldering Troubleshooting
  Getting outgassing out.
  Paul Lotosky
• The Defects Database
  Flip chip solder opens.
  Dr. Davide Di Maio
• Test and Inspection
  The need for reusable tests is driving standalone boundary scan-ICT integration.
  Jun Balangue
• Tech Tips
  Decapsulating ICs.
  ACI Technologies Inc.
• Getting Lean
  Supporting customers that might not have Lean.
  Ryan Wooten
• Solar Technologies
  Increased cell efficiencies.
  Darren Brown
• Technical Abstracts
  In case you missed it.