| Tackling SMT Enemy Number One: Raising the Standard of Solder Paste Application |
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| Written by Mydata Automation | |||
| Tuesday, 12 May 2009 11:42 | |||
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Is screen printing able to keep pace with quality demands and complex board layouts? Is new jet printing technology ready to fill the gap? A comparison study between the two methods reveals some interesting differences. Screen printers offer some possibilities for optimizing solder paste deposits, but optimization is far easier and quicker with the jet printer. At the same time, the ability to print individualized deposits on every single PCB pad may be the answer to the growing quality challenge.
http://www.mydata.com/myweb/sweden.nsf/
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| Last Updated on Tuesday, 12 May 2009 11:52 |
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