PCB Mounting Guidelines for Surface Mount Packages Print E-mail
User Rating: / 0
PoorBest 
Written by Amtel Corporation   
Tuesday, 02 April 2013 11:47

Introduction: This document provides PCB designers with a set of guidelines for successful board mounting of Atmel surface mount packages. Package Land Pattern descriptions are depicted by the package family, and although each family is represented by a single body size and lead count, the individual land description apply to all packages within a particular family. Land Pattern descriptions were provided by IPC-7351 Calculator from the Mentor Graphics Corporation. These are only general guidelines that Atmel received from the IPC-7351 Calculator. The solder reflow guidelines are derived from IPC -9502. Atmel does not make direct recommendation for board design, nor does it take legal liability and responsibility for the information in this document. Please refer to the IPC website for more information regarding board design and processing.

http://www.atmel.com/images/atmel-8826-seeprom-pcb-mounting-guidelines-surface-mount-packages-applicationnote.pdf

 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

Read more...
 
The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

Read more...
 

Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

Read more...
 
Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

Read more...
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Products

Panasonic Debuts PanaCIM Maintenance with Augmented Reality
PanaCIM Maintenance with Augmented Reality software provides instant communication and information to factory technicians -- when and where it is needed -- so they can respond to factory needs more...