| BTU Debuts Dynamo Reflow Oven |
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| Written by Chelsey Drysdale | |||
| Thursday, 17 January 2013 19:40 | |||
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Dynamo convection reflow oven is designed for portable electronics. Is for high-volume and high-thermal performance. Eight, 10, and 12 zone air or nitrogen models are available. BTU International, www.btu.com
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| Last Updated on Thursday, 07 March 2013 17:43 |
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EMS Introduces 535-18M-57 UV Cure Adhesive
535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive....
535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive....


