Two Worlds Converging: Chipshooting and Flip-chip Bonding Print E-mail
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Written by Eric Klaver and Patrick Huberts   
Wednesday, 15 August 2012 09:51

Two Worlds Converging: Chipshooting and Flip-chip Bonding

By Eric Klaver and Patrick Huberts

Pick-and-place equipment has over the years mostly evolved in four key areas; it is faster, more reliable, more accurate and more user friendly. Most pick & place vendors have aimed at the mass production market, while others have moved towards more dedicated markets – mostly where production flexibility is needed as with high-mix, prototyping or evaluation. But in the end, we’re all doing the same thing: picking and placing components on bare substrates.

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Last Updated on Wednesday, 15 August 2012 09:54
 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

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The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

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Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

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