| Power Integrity in Systems Design: Part 1 |
|
|
| Written by Mentor Graphics | |||
| Tuesday, 17 August 2010 09:39 | |||
|
Power Integrity in Systems Design: Part 1 This paper discusses the fundamental requirements of power integrity (PI), and the most important concept used in PI, the network impedance. It answers the questions commonly asked by digital designers on how a power delivery network (PDN) is represented, how PDN impedance is generally defined, what the target impedance is and its effective range, and the factors affecting impedance analysis. The paper also addresses the contributions of IC current, package inductance, and on-die capacitance to PDN impedance analysis.
|
|||
| Last Updated on Tuesday, 28 June 2011 13:05 |
Columns
| What’s Driving Electronics Packaging and Assembly Trends? |
Multi-die configurations and a switch to copper wires are rampant, and supercomputers are why. |
| Read more... |
| Bridging at Reflow |
What causes it, and can it be eliminated? |
| Read more... |
Features
| Current Trends in Conformal Coatings |
Custom formulations have become the norm. |
| Read more... |
| The Worldwide Industrial Electronics Assembly Markets Defined |
Test, clean energy and process control represent huge potential for EMS. |
| Read more... |
Products
ScanExpress version 7.7 boundary scan tool suite includes improved constraints handling, support for multi-core devices, and new JTAG Embedded Test support for additional Freescale and Texas...


