VS Series vacuum soldering systems feature fast heating and cooling rates, easy profile setup and editing, and data logging. Support use of different gases, formic acid and microwave plasma. All offer a small footprint, and said to reduce solder joints voids. Supports processes such as plasma cleaning and gas exchange for advanced packaging through controlled use of gases during the soft-soldering process at temperatures up to 450C, for oxide-free and void-free connection of chip and substrate. Permit flux-free soldering and use of solder preforms. Degassing and drying can be integrated into a single process. Models include VS320, VS160UG, and VS160S.

Rehm, rehm-group.com