| DELO, Ticona Develop Vectra LCP Adhesive |
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This adhesive permits Vectra LCP to adhere to FR4 and ceramic boards even after triple reflow process, without loss of adhesion. Is reportedly ideal for fine molded components. Is flowable and fills long, thin and complicated flow paths with minimal warpage. Is flame-retardant and heat distortion resistant up to 340°C. Shows a high compression shear strength. Ticona, www.ticona.com
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| European RoHS Enforcement Explained |
A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market. |
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| Believing Foxconn Means Suspending Belief |
The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down: |
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Features
| Managing Your ESD Program |
The processes are as important as the tools. |
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| SMT Reflow Oven-to-Oven Repeatability |
How to adjust an oven so a single recipe will work across multiple ovens for an individual product. |
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535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive....
