| Zymet Releases CN-1751-4 Underfill |
 |
 |
| Friday, 08 February 2013 11:54 | |||
|
CN-1751-4 underfill encapsulant is reportedly crack resistant; withstands flexing experienced by flexible printed circuitry or drops and shocks of thin printed circuit assemblies. Reportedly can withstand deformation without cracking; has a modulus higher than traditional reworkable underfills. Has a CTE of 48 ppm/°C. Viscosity is 900 cps. Can be reworked at 170° to 180°C to remove underfill fillet. Underfill residue is scraped off at 170° to 180°C. Zymet, www.zymet.com
|
Columns
| Semblant Warms to New Fluoropolymer Conformal Coating |
|
Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week. |
| Read more... |
| ECTC in Las Vegas |
What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here. This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31. |
| Read more... |
Features
| The Impact of Reel Splicing Kits on Setup and Changeover |
Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way. |
| Read more... |
| Standard Solar Cells vs. Next-Gen Cells: Which is Winning? |
Overcapacity is stalling the rate of improvement, but only for so long. |
| Read more... |
Search
Search
Login
CB Login
Language
Language
Products
EP30HV two-component epoxy is for bonding, sealing, coating and casting applications. Offers light transmittance from 350-2,400nm and has a refractive index of 1.55 at room temperature. Volume...
